IEEE CPMT Society has changed its name to the IEEE Electronics Packaging Society. Read more.

2018 19th International Conference on Electronic Packaging Technology (ICEPT) Shanghai, China Aug 8, 2018 - Aug 11, 2018 Abstract Submission Date: Mar 12, 2018
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) Melaka, Malaysia Sep 4, 2018 - Sep 6, 2018 Abstract Submission Date: Mar 31, 2018
2018 13th International Congress Molded Interconnect Devices (MID) Würzburg, Germany Sep 25, 2018 - Sep 26, 2018 Abstract Submission Date: Feb 28, 2018
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Stockholm, Sweden Sep 26, 2018 - Sep 28, 2018 Abstract Submission Date: Apr 10, 2018
2018 IEEE CPMT Symposium Japan (ICSJ) Kyoto, Japan Nov 19, 2018 - Nov 21, 2018 Abstract Submission Date: May 25, 2018
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Hong Kong Dec 17, 2018 - Dec 20, 2018 Abstract Submission Date: Jul 31, 2018

IEEE Electronics Packaging Award

 Bill Screen Shot Image 2

Recipient of 2018

IEEE Electronics Packaging Award

William Chen

         Fellow of ASE Group, Sunnyvale, California, USA 

“For contributions to electronic packaging from research and development through industrialization, and for his leadership in strategic roadmapping efforts.”
 
 

EuroSimE 2018

April 16 - 18, 2018
Toulouse, France

Join IEEE EPS

 

people_around_globe_blue

Join your professional colleagues –become a member of EPS.

 


IEEE Technology Navigator