2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021 Abstract Submission Date: Oct 16, 2020
View More Call for Papers →

IEEE Electronics Packaging Award

 KoyanagiRamm

Recipients of the 2020

IEEE Electronics Packaging Award

Mitsumasa Koyanagi and Peter Ramm

"For pioneering contributions leading to the commercialization of 3D wafer and die level stacking packaging"

2020 IEEE ITherm

Recorded Presentation Still Available On Demand

 


Join IEEE EPS
people_around_globe_blue

Join your professional colleagues –become a member of EPS.

 


 

IEEE Technology Navigator