2021 IEEE 71st Electronic Components and Technology Conference (ECTC) San Diego, CA USA Jun 1, 2021 - Jun 4, 2021 Abstract Submission Date: Oct 16, 2020
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IEEE Electronics Packaging Award


Recipients of the 2020

IEEE Electronics Packaging Award

Mitsumasa Koyanagi and Peter Ramm

"For pioneering contributions leading to the commercialization of 3D wafer and die level stacking packaging"

2020 IEEE ITherm

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