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2021 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)
Tel Aviv, Israel
Nov 1, 2021 - Nov 3, 2021
Abstract Submission Date: Apr 12, 2021
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IEEE Electronics Packaging Award
Recipient of the 2021
IEEE Electronics Packaging Award
Chin C. Lee
"For contributions to new silver alloys, new bonding methods, flip-chip interconnect, and education for electronics packaging"
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2021 Smart Systems Integration
Virtual Event April 27 - 29, 2021
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