Karikalan Bio - IEEE Electronics Packaging Society

Karikalan Bio

  Karikalan photo

SAM KARIKALAN (M:  1995, SM: 2003) has 30 years of experience in the Semiconductor and Electronic Systems Industry. He is currently a Senior Manager of Package Engineering R&D at Broadcom Limited, responsible for Electrical, Thermal and Mechanical design analysis and optimization of IC Packages and co-design of IPs and Systems. Prior to Broadcom, Sam held in technical or managerial positions at STATS ChipPAC, Primarion and Advanced Micro Devices, working on IC Package Design for Signal/Power Integrity and Electromagnetic Compatibility (EMC).

Before entering the semiconductor industry in 1998, Sam was a scientist at SAMEER-Centre for Electromagnetics in India, for over a decade, working on EMI/EMC Research & System Design and Radar technology. His current interests include Packaging Technologies for Performance Scaling, such as 2.5D/3D Integration, Design for Performance & Reliability, and Design for Test & Manufacturing. Sam holds a B.E. degree in Electronics & Communications Engineering from Bharathiar University, Coimbatore, India.

Sam has authored / co-authored 14 Conference/Journal papers on IC Packaging, Signal Integrity and EMI/EMC. He also has 20 issued US patents and several pending patents to his credit, on Interconnect design, 2.5D/3D Packaging and EMI/EMC. Sam has delivered few hundred hours of training lectures on Signal/Power Integrity and EMI/EMC at locations all across the globe, including two PDCs at the IEEE Electronic Components and Technology Conference (ECTC).

Sam has been a member of the IEEE for over 20 years and he is currently a Senior Member, with memberships in CPMT, EMC and MTT Societies. He has been very active in local chapters and sections in Singapore, Phoenix and Orange County (California), in various leadership roles, including the founding chairperson of the CPMT Orange County chapter. Sam has received several awards for his contributions to the IEEE, including the 2014 IEEE CPMT Regional Contributions Award - Regions 1-6, 7, 9 (US, Canada, Latin America) and the 2012 Outstanding Leadership Award from the Orange County Section. Sam has been serving on the Technical Program Committee and the Executive Committee of the IEEE ECTC since 2006 and he is the General Chair of ECTC 2018.