Karikalan Bio

  Karikalan photo

SAM KARIKALAN (M:  1995, SM: 2003) has 32 years of experience in the Semiconductor and Electronic Systems Industry. He is currently a Senior Manager of Package Engineering R&D at Broadcom Inc., responsible for Electrical, Thermal and Mechanical design analysis and optimization of IC Packages, Advanced Packaging Technology Path-finding, and co-design of IPs and Systems. Prior to Broadcom, Sam held technical or managerial positions at STATS ChipPAC, Primarion and Advanced Micro Devices, working on IC Package Design for Signal/Power Integrity and Electromagnetic Compatibility (EMC). Before entering the semiconductor industry in 1998, Sam was a scientist at SAMEER-Centre for Electromagnetics in India, for over a decade, working on EMI/EMC Research & System Design and Radar technology. His current interests include Heterogeneous Integration Technologies, Design for Performance & Reliability, and Design for Test & Manufacturing.

Sam has 23 issued US patents to his credit, on Interconnect design, 2.5D/3D Packaging and EMI/EMC. He also has authored / co-authored 14 Conference/Journal papers on IC Packaging, Signal Integrity and EMI/EMC and delivered few hundred hours of training lectures on Signal/Power Integrity and EMI/EMC at locations all across the globe, including two PDCs at the IEEE Electronic Components and Technology Conference (ECTC). Sam holds a B.E. degree in Electronics & Communications Engineering from Bharathiar University, Coimbatore, India.

Sam has been a member of the IEEE for over 20 years. He has been very active in local chapters and sections in Singapore, Phoenix and Orange County (California), in various leadership roles, including the founding chairperson of the CPMT Orange County chapter. Sam has received several awards for his contributions to the IEEE, including the 2014 IEEE CPMT Regional Contributions Award - Regions 1-6, 7, 9 (US, Canada, Latin America) and the 2012 Outstanding Leadership Award from the Orange County Section. Sam has been serving on the Technical Program Committee and the Executive Committee of the IEEE ECTC since 2006. Sam was the General Chair of the 2018 IEEE 68th ECTC.