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ALAN HUFFMAN (M: 2005, SM: 2007) is currently the Director of Engineering for Micross Advanced Interconnect Technology in Research Triangle Park, NC.  He received the B.S degree in physics from The University of North Carolina at Chapel Hill in 1994. From 1994 to 2005 he was a Member of the Technical Staff at MCNC Research & Development Institute working on development and implementation of wafer level packaging technologies, reliability and failure mode analysis of flip chip devices, and optoelectronic and MEMS packaging.  In 2005 he joined RTI International and was a Senior Research Engineer and Program Manager for WLP technology with RTI’s Electronics and Applied Physics Division. 

Over the course of his career, his focus has been on the development and implementation of advanced interconnect technologies, including wafer level packaging, flip chip and micro-bump interconnect, 2.5D and 3D integration, and characterization and process development for electronic materials used in these technologies.  He has authored or co-authored numerous papers and presentations on a number of advanced packaging topics, particularly on high density interconnect technologies and characterization of polymer material processes.  He was awarded an RTI President’s Award in 2012 for his contributions to the 3D microsystems program and received 6 Highly Published Author awards during his tenure with RTI International.

Alan has been an active member of IEEE EPS for over a decade, joining CPMT in 2005 and was elevated to Senior Member in 2007.  In 2005 he joined the Interconnections technical subcommittee for the Electronic Components and Technology Conference (ECTC) where he served for 8 years.  He has been a member of the ECTC Executive Committee since 2011 and served as the ECTC General Chair in 2016.  He joined the CMPT Board of Governors in 2016 as a Member at Large.