Hung Bio

CHIH-PIN (C. P.) Hung (M: 2017) is a member of both IEEE and EPS. He received his Ph.D. degree from the Department of Electrical and Electronic Engineering, University of Paisley (now, University of the West of Scotland), United Kingdom. Dr. Hung has been with ASE group for about 20 years. He is currently the Vice President, Corporate R&D of ASE Group. He leads the R&D teams developing the next-generation products and technology to be rolling out at the various ASE manufacturing sites. The products and technologies developed featuring integrated design technologies, advanced chip package, and system integration solutions. Dr. Hung has been involved with different management positions at ASE including VP of Corporate Design, VP of Central Engineering & Business Development, and VP of Logistic Services Integration. He has been also enthusiastically contributing his industry experiences in academic education by offering courses in various universities in Taiwan. In addition, Dr. Hung also has aggressive contributions to professional Societies. He has been Chair of PKG & TEST Committee, SEMICON Taiwan since 2013. He is currently the Co-Chair of 2018 IMPACT to be help in October 2018 in Taipei, Taiwan. He was also a member of ECTC Component & RF Committee during 2013-2015. Dr. Hung also served as peer reviewer for IEEE Trans. Advanced Packaging published by CPMT (now EPS). Through the years of research activities, Dr. Hung holds 72 patents and published over 49 conference and journal papers in the area of electronic packaging. His achievements have been well recognized which wan him Outstanding Youth Creative Award of 13th Industrial Technology Development Award (2005) from the Ministry of Economic, Taiwan.