Yokouchi Bio

Yokouchi

KISHIO YOKOUCHI (M: 2002, SM: 2016) is now a Head of Japan Jisso-Interconnect Solutions Laboratory (J2IS).  Also he is a Visiting Professor of Kanto Gakuin University.
He has been leading on development of high-end electronics interconnect technologies and thermal management technologies field on 38 years.  He has been also contributing on world major societies of electronics packaging technologies, such as IEEE EPS, IMAPS, and JIEP.

He received his Master’s degree in applied chemistry from Yokohama National University on 1979.  And he received his Ph. D. in thermal management engineering from the Osaka University on 2008.

In 1979, Dr. Yokouchi joined FUJITSU Laboratories Ltd., where he has been mainly engaged in R&D on high-density and high-speed signal transmission interconnect technologies based on material science.  During this period, he developed the world’s first copper conductor co-fired 60-layer 8-inch ceramic circuit board (the world's first LTCC), Ultra-fine pitch thin film circuit boards with low-k polymer for multi-chip modules (the world's first 2.5D packaging) for supercomputers/enterprise-servers.  Also, he has been involved with development of phase change liquid cooling technologies, such as direct immersion boiling cooling applied perfluorocarbons, liquid nitrogen for HEMT super-computer, and liquid helium for Josephson device.


From 2000 to 2004, Dr. Yokouchi was the director of the Advanced Optoelectronics Technology Dept. of FUJITSU Laboratories of America Inc., where he directed R&D work on optical monolithic integrated devices and optical interconnection technologies. 

From 2005, he has been Vice president, the Device & Materials Laboratories, FUJITSU Laboratories.
In 2007, He joined FUJITSU Interconnect Technologies, Ltd. (FICT) as a Vice president. In 2017, Dr. Yokouchi founded Japan Jisso-Interconnect Solutions Laboratory (J2IS).
He is also contribute as a Visiting Professor of Materials & Surface Engineering Research Institute, Kanto Gakuin University. He is the author or co-author of 55 technical presentations and publications, and invented or co-invented 72 U.S. and 100 Japanese patents. He co-authored three technical books.