MARK POLIKS (M: 2004) is Empire Innovation Professor of Engineering, Professor of Systems Science and Industrial Engineering, Professor of Materials Science and Engineering and Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. In 2006 he established the first research center (CAMM), to explore the application of roll-to-roll processing methods to flexible electronics and displays, with equipment funding from the United States Display Consortium (USDC) and the Army Research Lab. His research is in the areas of industry relevant topics that include: high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability. He has received more than $20M in research funding from Federal, New York State and corporate sources and more than $30M in equipment funding from federal and state sources. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. He leads the New York State Node of the DoD NextFlex Manufacturing USA and was named a 2017 NextFlex Fellow. He has authored more than one-hundred technical papers and holds forty-six US patents. Previously he held senior technical management positions at IBM Microelectronics and Endicott Interconnect. Poliks is a member of technical councils for the FlexTech Alliance, NBMC and NextFlex, and on the NextFlex Governing Council. He is an active member of the IEEE Electronics Packaging Society Electronic Component and Technology Conference and served and the 69th ECTC General Chair. Poliks received dual undergraduate degrees, with honors, in chemistry and mathematics from the University of Massachusetts and a Ph.D. from the University of Connecticut in materials science and engineering. He was a McDonnell-Douglas post-doctoral fellow working on solid-state magnetic resonance at Washington University, St. Louis before starting his career at IBM.