Bio Kroehnert

Steffen Kroehnert (M: 2011) is a well-known component of the Packaging Community for more than 10 years. He is President & Founder of ESPAT-Consulting based in Dresden, Germany. Steffen is providing a wide range of consulting services around Semiconductor Packaging, Assembly, Interconnect Technologies and Test, mainly for customers in Europe. Utilizing his large network in industry, institutes and academic, he also supports small- and medium-sized companies as well as innovative Start-ups to find the right packaging solutions for their products and setup the supply chain from prototypes to small series and High Volume Manufacturing (HVM). Until June 2019, he worked for 22 years in different R&D, engineering and management positions at large IDMs and OSATs in Germany and Portugal, namely Siemens Semiconductors Regensburg (1997-1999), Infineon Technologies Regensburg and Dresden (1999-2006) and Qimonda Dresden and Porto (2006-2009), where Steffen was instrumental in developing FBGA packaging technology for DRAM products. As Director of Technology, he helped setting up and making visible the company NANIUM Porto and Dresden (2009-2017), the largest OSAT in Europe, where Steffen has been heading R&D during introduction of System-in-Package (SiP) and technology transfer and scaling from 200mm to 300mm reconstituted wafer format of the leading Fan-Out Wafer Level Packaging Technology embedded Ball Grid Array (eWLB) from Infineon Technologies. After acquisition of NANIUM by Amkor Technology served as Senior Director Technology Development in Porto and Dresden (2017-2019) working with the European Business Development team.  Steffen founded and chaired the European SEMI integrated Packaging, Assembly and Test - Technology Community (ESiPAT-TC) inside SEMI Europe from 2016-2020, serving now as co-chair. His excellence in developing and innovating electronics packaging for semiconductor devices has resulted in authoring and co-authoring of 23 patent filings and many technical papers in the field of Packaging Technology. He co-edited the book “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies”. Since 2011, Steffen is co-chair of the Advanced Packaging Conference (APC) committee at SEMICON Europe, which is built of 22 packaging experts from European industry, institutes and academic. Steffen is active member of several technical and conference committees at IEEE EPS, IMAPS, SMTA and SEMI. He holds a M.Sc. degree in Electrical Engineering and Microsystems Technologies from the Technical University of Chemnitz, Germany.