Bio Yang

JIN YANG (M: 2009, SM: 2017) is a thermal architect with Intel Corporation located in Oregon USA. His research areas include, electronic and photonics packaging, and advanced package, component and system thermal management and microelectronics cooling. He has over 10 years of experiences in the areas of microelectronics manufacturing, electronic packaging and electronics cooling since he obtained his PhD degree in 2008. He was a senior staff engineer with Assembly, Test Technology Development (ATTD), Intel Corporation focused on next-generation disruptive thermal-mechanical technology development for meeting novel electronic package needs. He holds 14 US patents in the areas of electronic packaging and microelectronic cooling and has published over 30 peer-reviewed journal and conference papers. Prior to join Intel Corporation, Jin Yang obtained a PhD degree from Georgia Tech in Atlanta in the area of electronic packaging. Before that, he obtained his master degree and bachelor degree from Texas A&M University (College Station, TX) and Tsinghua University (Beijing, China) respectively.

Jin is an elected IEEE senior member and serves technical sub-committee chair of IEEE EPS (electronic packaging Society) ECTC and track chair of IEEE ITHERM. He has been a member of IEEE ECTC Assembly and Manufacturing Technology (AMT) committee since 2010 and served as assistant chair and chair for this committee for 2019 and 2020 respectively. During the last four years, he has served as track chair for IEEE IHTERM since 2016.

Outside IEEE, Dr. Yang has a long history of continued service to ASME community in the area of electronic and photonic packaging and has taken a leadership role in ASME Electronic and Photonic Packaging Division (EPPD). He serves as General Chair of InterPACK’2020 conference, flagship conference of ASME Electronic and Photonic Packaging Division (EPPD) and served as program co-chair and track chair in the last four years. He is Associate Editor of ASME Journal of Electronic Packaging (JEP). He once received Journal of Electronic Packaging Associate Editor of the Year Award. He is also a member of K-16 (K-16: Heat Transfer in Electronic Equipment). I served in ASME EPPD Technical Committee in 2009-2010. I also served as a liaison for over three years for SRC (Semiconductor Research Corporation) projects between the research institutions and participating companies and helped expedite research work and collaboration between them.