Bio Chan

 

BENSON CHAN (M’20-SM’20) received his B.S. in Mechanical Engineering in 1981 and M.S. in Engineering Science in 1987 from Rensselaer Polytechnic Institute. Mr. Chan has solid background in Electronic Packaging, with strong emphasis in High Speed Applications and Electrical Connector design. Mr. Chan had a diverse career with IBM for 22 years in the areas of Process Engineer, Design Engineer and Development Engineer. At IBM he was an Advisory Engineer in the Connector Development group responsible for developing custom connectors used in I, P and Z series mainframes for IBM. He was also the lead mechanical engineer for the development of the first 10Gbps x 12 optical transceiver in IBM. In the last 4 years at IBM, he was a taskforce lead managing members around the world responsible for correcting problems with LGA connectors for Z series systems as well as the 10K RPM hard drives for IBM.

After IBM, he was with Endicott Interconnect Technologies for 12 years as a Chief Scientist. At EIT, he was the principal investigator for the DARPA Terabus III program, responsible for the design and build of a flexible optical waveguide capable of 25Gbps per channel with 48 channels interconnecting 2 hybrid optical modules. For a large DoD project, he provided all packaging options to dense pack the maximum number of processing elements into a given space, he also provided thermal solutions to support a 72KW cabinet.

 

Mr. Chan is currently the Associate Director for the Integrated Electronics Engineering Center at Binghamton University, this center is a NY State Center for Advanced Technology and has a mission to work with companies to understand their use of electronics to improve their business by understanding the design, reliability and failures of their products. He has also been instrumental in increasing the exposure of the GE/BU Electronics Packaging Symposium, this is a yearly symposium dedicated to the electronics industry, since starting at Binghamton, this symposium has grown 3 x in attendance and 40 x in exhibitors. It is now seen as the largest east coast event focused on the trends of electronics ranging from power packaging to wearable flexible electronics for medical uses.

 

Mr. Chan holds 54 Patents in the fields of electronic packaging and advanced Connectors. He has 18 published papers in the fields of electronic packaging and connectors (ECTC, iMAPS, Photonics Journal, Fleck Research). Mr. Chan is a director for iMAPS and the president of the Empire Chapter of iMAPS. He is the chair of the Emerging Technologies Committee for ECTC and a member of IEEE EPS. He is on the TWG for the Heterogeneous Integration Roadmap for Single/Multichip, MEMS and Mobile.

 

Mr. Chan received the 2019 iMAPS Outstanding Educator award at the 2019 National iMAPS meeting in Boston.