Bio Sauter

WOLFGANG SAUTER (M’16) is a Distinguished Engineer at Marvell. He received his Ph.D. in Mechanical Engineering from The University of Vermont in 2000, and his M.S. in Mechanical Engineering from The Technical University of Munich in 1997. From 2000 until 2015, he worked in packaging development at IBM, leading several development projects on new technology introduction, flip chip development, component reliability improvements, and CPI (Chip Package Interaction). With the acquisition of IBM’s Microelectronics Division by GLOBALFOUNDRIES, Wolfgang moved to a customer facing role in the ASIC organization, where he was the primary contact for all advanced packaging product discussions and owns roadmap definition for future technology nodes. Since joining Marvell in 2019, Wolfgang is responsible for all Marvell ASIC product packaging solutions, and drives the packaging technology roadmap for ASIC and across Marvell. Wolfgang holds over 130 patents and has authored or co-authored numerous papers and presentations on a number of advanced packaging topics.