Bio Tan

CHUAN SENG TAN (S’01-M’06-SM’19) is a Professor of Electronic Engineering at the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore. He received his PhD from MIT in 2006. Currently, he is working on process technology of three-dimensional integrated circuits (3D IC), as well as engineered substrate (Si/Ge/Sn) for group-IV photonics. He has numerous publications (journal and conference) and IPs on 3D technology and engineered substrates. Nine of his inventions have since been licensed to a spin-off company. He co-edited/co-authored five books on 3D packaging technology.

He is a senior member of IEEE and a recipient of the Exceptional Technical Achievement Award from the IEEE Electronics Packaging Society (EPS) in 2019. Beginning June 2019, he is a Distinguished Lecturer with IEEE-EPS. He is a Fellow of the International Microelectronics Assembly and Packaging Society (IMAPS) since 2019 and a recipient of the William D. Ashman - John A. Wagnon Technical Achievement Award in 2020.

He was the Chair of the Interconnections Sub-Committee for ECTC’2021. He was the General Chair of the 2020 IEEE Electronics Packaging Technology Conference (Virtual). In addition, he is an Associate Editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology and was recognized with the Best Associate Editor Award in 2021.