Saratoga Springs, NY USA
Apr 30, 2018 - May 3, 2018
May 16, 2018 - May 20, 2018
May 22, 2018 - May 25, 2018
ALAN HUFFMAN (M: 2005, SM: 2007) is currently the Director of Engineering for Micross Advanced Interconnect Technology in Research Triangle Park, NC. He received the B.S degree in physics from The University of North Carolina at Chapel Hill in 1994. From 1994 to 2005 he was a Member of the Technical Staff at MCNC Research & Development Institute working on development and implementation of wafer level packaging technologies, reliability and failure mode analysis of flip chip devices, and optoelectronic and MEMS packaging. In 2005 he joined RTI International and was a Senior Research Engineer and Program Manager for WLP technology with RTI’s Electronics and Applied Physics Division.
Over the course of his career, his focus has been on the development and implementation of advanced interconnect technologies, including wafer level packaging, flip chip and micro-bump interconnect, 2.5D and 3D integration, and characterization and process development for electronic materials used in these technologies. He has authored or co-authored numerous papers and presentations on a number of advanced packaging topics, particularly on high density interconnect technologies and characterization of polymer material processes. He was awarded an RTI President’s Award in 2012 for his contributions to the 3D microsystems program and received 6 Highly Published Author awards during his tenure with RTI International.
Alan has been an active member of IEEE EPS for over a decade, joining CPMT in 2005 and was elevated to Senior Member in 2007. In 2005 he joined the Interconnections technical subcommittee for the Electronic Components and Technology Conference (ECTC) where he served for 8 years. He has been a member of the ECTC Executive Committee since 2011 and served as the ECTC General Chair in 2016. He joined the CMPT Board of Governors in 2016 as a Member at Large.
Become a member of the HI Roadmap
To become a contributing member of the Roadmap:
1. Provide a brief resume showing you have a technical background that qualifies you to make a contribution to the development of the 2016 edition of the HIR (one-page maximum).
2. Indicate the area of the roadmap activity where you would like to concentrate your contribution.
3. Confirm commitment to attend at least one face-to-face Roadmap workshop each year. Most of work will be done with through WebEx sessions and the use of a collaborative asynchronous authoring tool.
4. Confirm commitment to accept writing/editing assignments in the area of your expertise.
2016 CPMT Award Recipients
Electronics Manufacturing Technology Award
ASE, Shanghai, China
For pioneering work in development and mass production of new packaging technologies and processes, including the first BGA interconnection, as well as characterization methodologies for reliability evaluation/predication and thermal solutions in semiconductor packaging.
Outstanding Sustained Technical Contribution Award
IBM T. J. Watson Research Center, USA
For outstanding contributions to the fundamental understanding, optimization, and manufacturing implementation of Pb-free solders and contact metal layers for high performance chip interconnects.
Exceptional Technical Achievement Award
Huazhong University of Science and Technology, China
For exceptional contribution in modeling and experimental characterization of IC/LED packaging, focusing primarily on thermal packaging and innovations in packaging processes.
David Feldman Outstanding Contribution Award
Cisco Systems, Inc., USA
For outstanding leadership of the CPMT Society as Vice President and President, with key impact on globalization, industry connections, technical committee revitalization, as well as initiating transformation to prepare the Society for rapid, disruptive changes in the semiconductor and electronics industries.
Regional Contribution Award - Region 8 (Europe, Africa, Middle East)
Budapest University of Technology and Economics, Hungary
For outstanding contributions in promoting electronic packaging and IEEE EPS networking activities in East Europe and Region 8, including founding the ISSE - International Spring Seminar on Electronics Technology and establishing and developing the IEEE EPS Hungary-Romania Joint Chapter.
Regional Contribution Award - Region 10 (Asia & Pacific)
FUJIKURA Ltd., Japan
For contributions to the reconstruction and activation of the CPMT Japan Chapter as Vice Chair and Chair, and leadership in electronics and photonics packaging technologies development in Japan.
CPMT President's Message on Proposed IEEE Constitutional Amendment
At its November 2015 meeting, the IEEE Board of Directors proposed revisions to the IEEE Constitution. The revisions, in the form of a Constitutional Amendment, are to be voted upon by the IEEE membership as part of the 2016 IEEE election ballot that opened on 15 August and will close on 3 October. The revisions have the stated objective: “Create a nimble, flexible, forward-looking organization.”
You may have received information and viewpoints on the proposed revisions from a variety of sources, including other Societies of which you are a member.
The CPMT Society leaders have discussed the proposed revisions and the viewpoints expressed by those opposing (including a majority of IEEE Societies) and those supporting them. The result of our discussions was consensus for opposition to the proposed revisions.
Key reasons for the opposition are:
1. The problem that the proposed revisions are attempting to solve is not well-defined;
2. The existing IEEE Constitution offers alternative, less complex ways of accomplishing the intended improvements;
3. There are considerable unknowns associated with still-to-be-written bylaws under the proposed revisions; and
4. The risk associated with a major constitutional change is not clearly outweighed by its possible benefits.
You can become more familiar with the pros and cons of the amendment, and exercise your right to vote in this critically important juncture for the IEEE.
You can learn more about the proposed amendment at https://www.ieee.org/about/corporate/election/2016_constitutional_amendment.html.
The rationale for opposition to the constitutional amendment and proposed restructuring can be found at https://ieee2016blog.wordpress.com.
For background, the IEEE governing documents, including the Constitution and Bylaws, are available at http://www.ieee.org/about/corporate/governance/index.html.
The IEEE Technical Activities Board (TAB) has formed a TABin2030 Committee to consider the amendment’s implications. Additional materials to the pros and cons and the TABin2030 webinars and analyses can be found by visitinghttp://ta.ieee.org/strategic-planning/tab-in-2030.
2016-2017 EPS President