Opportunities for Participation in and Funding from National Packaging Development Efforts:

NAPMP:  National Advanced Packaging Manufacturing Program:  $2.5B funding from Chips Act with industry and academia carrying out shared research.  NIST is parent organization. 

-          Share of $11B of Chips Act $52B

NGMM (Next Generation MicroElectronics Manufacturing) Development “Commons”.  Parent organization is DARPA.

The Microelectronics Commons: DoD initiative using Chips Act funding for a national network to create direct pathways to commercialization for US microelectronic researchers and designs for “lab to fab”.

National Semiconductor Technology Center (NSTC);  charter is to develop a strong semiconductor research and development ecosystem https://www.nist.gov/chips/national-semiconductor-technology-center

IEEE Global Semiconductors Adhoc. Goals: To inform community regarding Chips Act initiatives; Engage IEEE members (focus on Workforce Development); Support involvement of industry in STEM professions

ASIC (American Semiconductor Innovation Coalition). 

STEAMPIPE (Strategic Transition of MicroElectronics to Accelerate Modernization by Prototyping and Innovation in the Packaging EcoSystem)  

SHIP (State of the Art Heterogeneous Integration and Packaging Initiative)

RAMP (Rapid Assured MicroElectronics Prototyping).  DoD is parent organization

European Chips Act

Indian Semiconductor Mission

Beginning with the 2023 renewal cycle, EPS members will have access to the new EPS Digital Library! 

This will include online access via Xplore to the Transactions on Components, Packaging and Manufacturing Technology (T-CPMT), EPS sponsored conference proceedings including ECTC, ESTC, ITherm and more! 

Unlimited access to current and past issues of T-CPMT and proceedings for EPS sponsored conferences from current year to the early nineties.

6-8 November 2023

David Intercontinental Hotel Tel Aviv, Israel

On behalf of the IEEE COMCAS 2023 Steering Committee, it is our pleasure to launch the 9th International IEEE Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems (IEEE COMCAS 2023). In 2023 the international IEEE COMCAS will continue to evolve and provide an advanced multidisciplinary forum for the exchange of ideas, research results, and industry experience in a range of key areas i.e., microwaves, communications and sensors, antennas, biomedical engineering, RF and microwave devices and circuits, thermal management and electronic packaging, signal processing and imaging, as well as radar, acoustics and microwave system engineering. In its entirety the event includes a technical program, industry exhibits, and guest presentations from global experts on recent academic and industry advancements.

In launching the 2023 event, we would also like to welcome you to the sunshine of the eastern Mediterranean, in Tel Aviv. As a cosmopolitan city of stunning views and endless innovation Tel Aviv is a center that resonates with an energized atmosphere, streets of storied history, and an internationally recognized nightlife. Taking place 6-8 November 2023 in Tel Aviv, Israel, at the David Intercontinental Hotel by the Mediterranean Sea; IEEE COMCAS will continue a biennial series tailored to maximize professional networking, support the candid exchange of ideas, and develop a range of enduring opportunities.

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The EPS proudly congratulates the inaugural receipents of the IEEE Certificate of Distinguished Achievement for Technical Leadership and Expertise:

Chong Leong Gan 

Scott Clary