2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging (SIITME)
SIITME provides an international forum for dissemination of information and scientific results relating to education, research and development activities. This conference is a premier European forum for the exchange of information between experienced scientists and academic communities within electronic industries. There is a unique combination of oral and poster presentations as well as individual meetings where researchers can come together to discuss scientific problems and organize international cooperation in a convenient atmosphere during the three-day conference.
•SIITME 2018 was a SUCCESS!!!
•154 participants from 9 countries
•6 Keynote speakers (2 – Germany and 4 -- United States)
•IEEE members 39
•10 companies were exhibitors
•95 conference presentations
•2 workshops focused on: human resource issues and, reliability aspects on design and manufacturing electronic products
Saratoga Springs, NY USA
Apr 30, 2018 - May 3, 2018
May 16, 2018 - May 20, 2018
May 22, 2018 - May 25, 2018
2016 CPMT Award Recipients
Electronics Manufacturing Technology Award
ASE, Shanghai, China
For pioneering work in development and mass production of new packaging technologies and processes, including the first BGA interconnection, as well as characterization methodologies for reliability evaluation/predication and thermal solutions in semiconductor packaging.
Outstanding Sustained Technical Contribution Award
IBM T. J. Watson Research Center, USA
For outstanding contributions to the fundamental understanding, optimization, and manufacturing implementation of Pb-free solders and contact metal layers for high performance chip interconnects.
Exceptional Technical Achievement Award
Huazhong University of Science and Technology, China
For exceptional contribution in modeling and experimental characterization of IC/LED packaging, focusing primarily on thermal packaging and innovations in packaging processes.
David Feldman Outstanding Contribution Award
Cisco Systems, Inc., USA
For outstanding leadership of the CPMT Society as Vice President and President, with key impact on globalization, industry connections, technical committee revitalization, as well as initiating transformation to prepare the Society for rapid, disruptive changes in the semiconductor and electronics industries.
Regional Contribution Award - Region 8 (Europe, Africa, Middle East)
Budapest University of Technology and Economics, Hungary
For outstanding contributions in promoting electronic packaging and IEEE EPS networking activities in East Europe and Region 8, including founding the ISSE - International Spring Seminar on Electronics Technology and establishing and developing the IEEE EPS Hungary-Romania Joint Chapter.
Regional Contribution Award - Region 10 (Asia & Pacific)
FUJIKURA Ltd., Japan
For contributions to the reconstruction and activation of the CPMT Japan Chapter as Vice Chair and Chair, and leadership in electronics and photonics packaging technologies development in Japan.
ALAN HUFFMAN (M: 2005, SM: 2007) is currently the Director of Engineering for Micross Advanced Interconnect Technology in Research Triangle Park, NC. He received the B.S degree in physics from The University of North Carolina at Chapel Hill in 1994. From 1994 to 2005 he was a Member of the Technical Staff at MCNC Research & Development Institute working on development and implementation of wafer level packaging technologies, reliability and failure mode analysis of flip chip devices, and optoelectronic and MEMS packaging. In 2005 he joined RTI International and was a Senior Research Engineer and Program Manager for WLP technology with RTI’s Electronics and Applied Physics Division.
Over the course of his career, his focus has been on the development and implementation of advanced interconnect technologies, including wafer level packaging, flip chip and micro-bump interconnect, 2.5D and 3D integration, and characterization and process development for electronic materials used in these technologies. He has authored or co-authored numerous papers and presentations on a number of advanced packaging topics, particularly on high density interconnect technologies and characterization of polymer material processes. He was awarded an RTI President’s Award in 2012 for his contributions to the 3D microsystems program and received 6 Highly Published Author awards during his tenure with RTI International.
Alan has been an active member of IEEE EPS for over a decade, joining CPMT in 2005 and was elevated to Senior Member in 2007. In 2005 he joined the Interconnections technical subcommittee for the Electronic Components and Technology Conference (ECTC) where he served for 8 years. He has been a member of the ECTC Executive Committee since 2011 and served as the ECTC General Chair in 2016. He joined the CMPT Board of Governors in 2016 as a Member at Large.
Become a member of the HI Roadmap
To become a contributing member of the Roadmap:
1. Provide a brief resume showing you have a technical background that qualifies you to make a contribution to the development of the 2016 edition of the HIR (one-page maximum).
2. Indicate the area of the roadmap activity where you would like to concentrate your contribution.
3. Confirm commitment to attend at least one face-to-face Roadmap workshop each year. Most of work will be done with through WebEx sessions and the use of a collaborative asynchronous authoring tool.
4. Confirm commitment to accept writing/editing assignments in the area of your expertise.