About - IEEE Electronics Packaging Society

Lau Bio

John H. Lau (M’ 88, SM’93, F’17, LF’ 18) has been a senior technical advisor of ASM since 2014, an ITRI Fellow of Industrial Technology Research Institute for 5 years, a visiting professor at HKUST for 1 year, the Director of MMC Laboratory with IME Singapore for 2 years and a Senior Scientist/MTS at HP Lab/Agilent in California for more than 25 years. With more than 39 years of R&D and manufacturing experience in semiconductor packaging, he has published more than 450 peer-reviewed papers, 30 issued and pending US patents, and 18 textbooks on flip chip technologies, WLCSP, FOWLP, BGA, TSV for 3D integration, advanced MEMS packaging, lead-free solder and manufacturing, and reliability of 2D and 3D IC interconnections. John received many awards and is an elected ASME Fellow, IEEE Fellow, and IMAPS Fellow. 

 

Taira photo

YOICHI TAIRA (M:  1989) received his B.S. degree from Kyoto University and Ph.D. degree from University of Tokyo, both in Physics. From 1983 to1988, he was an Associate Professor with the Institute for Laser Science, University Electro-Communication, Tokyo.  From 1988 to 2015, he was a Research Staff with IBM Research mostly in Tokyo. From 1989 to 1990, he was with IBM T.J. Watson Research Center.  In 1998, he became an IBM Senior Technical Staff Member.  Since 2015, he has been a Visiting Professor with Keio University. He is also involved in photonic packaging at IBM TJ Watson Research Center. He has been involved in various science and technology areas including technology research on various aspect of lasers including femtosecond laser technology, nonlinear optics, high power laser and UV lasers; VLSI design of memory and CPU; flat panel display technology including liquid crystal and organic light emitting materials; chip packaging including flip chip packaging, underfilling, chip cooling and chip stacking; high performance computer architecture including optical interconnects; nanometer precision fine molding technology, silicon photonic chip packaging and optically transparent adhesives  He is the author of 5 books, more than 160 articles, and more than 60 inventions.

Some of the activities he is involved in for governing and administration of academic, society and related organizations include: Chair of IEEE EPS Japan Chapter; Auditor of Japan Institute of Electronics and Packaging (JIEP); General Chair of the 2017 Annual Meetings of Japan Institute of Electronics and Packaging; Chair of Optical Packaging Technology Committee in Japan Institute of Electronics and Packaging; Member of ECTC Materials and Processing Program Subcommittee

 

His technical interest includes: Laser science and it application to computer communication; Sensors using optics; Display technology; Precision assembly of electronics/opto-electronic components; Chip cooling and systems cooling; System and network architecture and technology; Technology enabling advanced packaging.

 

 

Fan Photo

XUEJUN FAN (M:  2002, SM: 2006) is currently a professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. Over 25 years he has made many significant and distinguished contributions and outstanding achievements in several important fields encompassed by the IEEE EP Society. He is a well-known and internationally recognized expert in thermal and thermo-mechanical reliability, modeling and characterization of electronic materials, IC packaging and reliability, and LED packaging and system integration. He received the Outstanding Sustained Technical Contribution Award in 2017 and the Exceptional Technical Achievement Award in 2011. His papers received the Best Paper Award in IEEE Transactions on Components and Packaging and Technology in 2017 and 2008, respectively.

Dr. Fan received his PhD from Tsinghua University, Beijing, China in 1989. He became a full professor in 1991, at the age of 27, at Taiyuan University of Technology (TUT), China. He was one of the youngest professors in China at that time. Dr. Fan served as Associate Department Chair (1990-1993) and the Director of Institute of Applied Mechanics (1994-1997) at TUT. He was Visiting Professors at the University of Tokyo, Japan (1993-1994), and the University of British Columbia, Canada (1996-1997), respectively. He became a Member of Tech Staff and Group Leader at the Institute of Microelectronics (IME), Singapore (1997-2000), and then, Senior Member of Research Staff at Philips Research, Briarcliff Manor, New York (2001-2004), and Senior Staff Engineer at Intel Corporation (2004 – 2007), and a professor at Lamar University (2007 - present).

 

Dr. Fan has published more than 220 papers, including over three books, 25 book chapters, and over 100 journal papers, and several patents. His publication h-index is 24. His first co-authored book “Mechanics of Microelectronics” has been adopted by some universities as textbooks. His book “Moisture Sensitivity of Plastic Packages of IC Devices’ has been downloaded over 5000 times since its publication in 2011. His book on “Solid State Lighting Reliability: Components to System”, has been downloaded over 40,000 times since its publication in 2012. Dr. Fan is a key contributing member for several white papers on solid state lighting reliability released by the Department of Energy (DOE), and a contributing member for a new JEDEC standard: JESD22-B111A: Board Level Drop Test Method of Components for Handheld Electronic Products, which is released in November 2016. Dr. Fan also serves as Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.

Dr. Fan has been very actively leading and participating in many IEEE/CPMT activities in last 15 years. He has served General Co-Chair (2012 – present), Program Chair (2010), and Technical Chair/Co-Chair (2005 – 2010) for ICEPT since 2005. Dr. Fan has been serving ECTC technical committee since 2003, and attends ECTC planning meeting in Dallas and ECTC conference every year. Dr. Fan has been one of the founding members for EuroSimE, which has become one of the specialized CPMT conference in modeling, simulation and characterization in heterogeneous system. Dr. Fan also serves as program /technical/ advisory committee members for EPTC, ESTC, IRPS, IEMT, EMPC, etc. Dr. Fan has been an ECTC PDC instructor since 2005. As IEEE Distinguished Lecturer, he has given numerous keynotes and tutorials around world each year on behalf of CPMT society. He has become a key liaison between CPMT BoG and ICEPT Executive Committee, in which he has developed the fruitful partnership between CPMT society and China Electronics Packaging Technology Society. He is currently serving as co-Chair for Modeling/Co-Design in Heterogeneous Integration Roadmap Committee.

 

OMalley photo

GRACE O’MALLEY (M: 2012) is Vice President of Global Operations for the International Electronic Manufacturing Initiative (iNEMl). Based in Limerick, Ireland, she supports the global iNEMl team and activities including managing collaborative projects, the iNEMl Roadmap process and interactions with the larger technical community in Europe. Grace's background is in electronics materials and manufacturing research. Prior to iNEMI, she worked for Motorola in the US on the development and deployment of direct chip attach/ flip chip capabilities and low-cost assembly processes in to production. She also spent approximately two years establishing and leading a multidisciplinary research team at Motorola's site in Jaguariuna, Brazil, supporting the volume manufacturing of cell phones, radios and cellular infrastructure for the Latin America markets. Grace started her career as a research engineer, focused on electronics packaging and board assembly, at the Tyndall National Institute, Cork, Ireland.

Grace has an honours bachelor's degree in electrical engineering from University College Cork, Ireland (1988), and a master of science in materials and manufacturing engineering from the Illinois Institute of Technology, Chicago, U.S.A. (1998). She has authored papers and presentations for a number of journals and conferences including IEEE-TCPMT and ECTC. She holds eight U.S. patents, and has been a member of IEEE for 25 years. A long-time supporter of EPS events, Grace recently worked on the organizing committee of the CPMT R2i-2017 Innovation Workshop in Dublin, Ireland; a one day event to connect researchers and their product ideas with industry and potential funding.

 

 

  Karikalan photo

SAM KARIKALAN (M:  1995, SM: 2003) has 30 years of experience in the Semiconductor and Electronic Systems Industry. He is currently a Senior Manager of Package Engineering R&D at Broadcom Limited, responsible for Electrical, Thermal and Mechanical design analysis and optimization of IC Packages and co-design of IPs and Systems. Prior to Broadcom, Sam held in technical or managerial positions at STATS ChipPAC, Primarion and Advanced Micro Devices, working on IC Package Design for Signal/Power Integrity and Electromagnetic Compatibility (EMC).

Before entering the semiconductor industry in 1998, Sam was a scientist at SAMEER-Centre for Electromagnetics in India, for over a decade, working on EMI/EMC Research & System Design and Radar technology. His current interests include Packaging Technologies for Performance Scaling, such as 2.5D/3D Integration, Design for Performance & Reliability, and Design for Test & Manufacturing. Sam holds a B.E. degree in Electronics & Communications Engineering from Bharathiar University, Coimbatore, India.

Sam has authored / co-authored 14 Conference/Journal papers on IC Packaging, Signal Integrity and EMI/EMC. He also has 20 issued US patents and several pending patents to his credit, on Interconnect design, 2.5D/3D Packaging and EMI/EMC. Sam has delivered few hundred hours of training lectures on Signal/Power Integrity and EMI/EMC at locations all across the globe, including two PDCs at the IEEE Electronic Components and Technology Conference (ECTC).

Sam has been a member of the IEEE for over 20 years and he is currently a Senior Member, with memberships in CPMT, EMC and MTT Societies. He has been very active in local chapters and sections in Singapore, Phoenix and Orange County (California), in various leadership roles, including the founding chairperson of the CPMT Orange County chapter. Sam has received several awards for his contributions to the IEEE, including the 2014 IEEE CPMT Regional Contributions Award - Regions 1-6, 7, 9 (US, Canada, Latin America) and the 2012 Outstanding Leadership Award from the Orange County Section. Sam has been serving on the Technical Program Committee and the Executive Committee of the IEEE ECTC since 2006 and he is the General Chair of ECTC 2018.