Electronics Manufacturing Technology Award
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Purpose:
Nomination Period Now Closed for 2021 Awards
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- To recognize major contributions to Electronic Manufacturing Technology in fields encompassed by the EPS.
- Award:
- US$3,000 and Certificate
- Basis for judging:
- Eligibility:
- Membership in IEEE or the EPS is not required.
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See nomination form for full details.
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2020 RECIPIENT
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Mostafa Aghazadeh
Intel, USA
For sustained excellence in leading the world's largest Assembly Development effort to deliver state of the art advanced multi-chippackaging technologies.
PAST RECIPIENTS
2019 Jie Xue
for over 20 years of technical contributions to the microelectronic packaging industry
2018 Douglas Yu
for the Development and high-volume manufacturing of interposers and Wafer-Level Fan-Out Packaging.
2017 Daniel Lu
for significant contributions to improve the manufacturing process of mobile devices with innovative materials and processing solutions.
2016 Yifan Guo
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for pioneering work in development and mass production of new packaging technologies and processes, including the first BGA interconnection, as well as characterization methodologies for reliability evaluation/predication and thermal solutions in semiconductor packaging.
2015 Steve Bezuk
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for pioneering development, manufacturing and implementation work in mobile device packaging in the areas of interconnect technology, package structures, and package and substrate materials development and reliability.
2014 Raj Master
for pioneering managerial and technical leadership in packaging technology and manufacturing, thermal solutions, substrate technology and manufacturing, and flip chip bumping that significantly impacted advancements of electronic products in the industry.
2013 Wen-Pin (Louie) Huang
for contributions to the development and implementation of copper wire bond technology in high volume production.
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2012 Chin C. Lee
for significant enhancements to interconnect manufacturing through research, invention and education.
2011 Mark Brillhart
for developing manufacturing technologies and industry supply chain capabilities in the areas of high-performance ASIC packaging, system in package, 3D and wafer-level packaging of high-speed memory and optics, and advanced coreless organic substrates for high-reliability networking products
2010 Ning-Cheng Lee
for being a driving force in removing the ‘art’ of SMT assembly and replacing it with science.
2009 Ho-Ming Tong
for pioneering development, manufacturing and implementation work in flip chip packaging, in applications spanning high-end computing to cost-sensitive applications in computing, communications, consumer and car electronics.
2008 Shi-Wei (Ricky) Lee
for his significant research in various areas of packaging, and his worldwide dissemination of that research through teaching, authored books, journals, articles, technical conference presentations and short courses.
2007 Herbert Reichl
for his outstanding contributions in research and education in the field of microelectronics packaging and for his pioneering role in the integration of reliability aspects.
2006 Nasser Grayeli
for contributions to electronic packaging and assembly technologies through leadership in Intel Corporation and iNEMI.
2005 Robert C. Pfahl, Jr.
for developing new manufacturing processes, reducing the environmental impact of electronic manufacturing processes,2007 and fostering collaboration within the manufacturing technology community.
2004 Michael J. Varnau
for his major contributions in automotive electronic packaging, printed solder flip chip technology development and high volume implementation.
2003 Bruce Freyman
for his pioneering work in developing the PBGA package and for his vision and drive in making the PBGA package and its format commercially successful.
2002 Scott Kulicke
2001 Walt Trybula
2000 Rama Shukla
1999 Dimitry Grabbe
1998 Paul Totta
1997 No award given
1996 Michael Cassidy
1995 No award given