Exceptional Technical Achievement Award
Purpose: To recognize an individual, or group of individuals (no more than three), for exceptional technical achievement in the fields encompassed by the EPS.
Award: US$2,500 and Certificate
Basis for judging: Technical contributions of the nominee(s) must be such that they are considered to be exceptional, not achieved by most members. A single major contribution will qualify for this award. The contribution could be a significant invention, introduction of a significantly new and important technology or product (in which case, the nominee may be a team leader), or significant work that advances the state-of-the-art in EPS's field of interest. The technical contributions must be documented by open literature publications such as papers, patents, books, and reports (available to the public). Technical recognition and awards from the organization employing the individual as well as awards from other IEEE and non-IEEE technical societies may also be contributory.
Eligibility: Recipient(s) must have been a member of IEEE and EPS for at least the past three years and renewed for the year of the Award.
Bing DangIBM, USA
For contributions to the research and development of 2.5D and 3D system integration, interconnect technologies and materials processes.
2019 Chuan-Seng Tan
for technical contributions and leadership in 3D packaging and integration, particularly on solder-less Cu-Cu bonding and innovations in TSV technology.
2018 Muhannad Bakir, Kuan-Neng Chen and Katsuyuki Sakuma
for contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies.
2017 Ephraim Suhir
for the development of numerous probabilistic design concepts that enable effective and rapid assessment of the probability or failure of electronic products.
2016 Xiaobing Luo
for exceptional contribution in modeling and experimental characterization of IC/LED packaging, focusing primarily on thermal packaging and innovations in packaging processes.
for major contributions in the area of 2.5D/3D ICs integration, focusing primarily on process development and reliability, and stress sensor technology.