S.W. Ricky Lee
Hong Kong University of Science and Technology (HKUST), Hong Kong
For two decades of continuous contributions and professional leadership in multiple technical fields encompassed by EPS, including solder joint reliability, lead free transition 3D IC integration, and LED packaging.
2018 Pradeep Lall
For outstanding sustained contributions to the design, reliability and prognostics for harsh environment electronics systems.
2017 Xuejun Fan
for sustained and outstanding contributions to the modeling and characterization of IC packaging, LED packaging and system reliability, and new interconnect material development in wafer level packaging, 3D integration and power electronics packaging.
2015 GQ (Kouchi) Zhang
for 20 years of technical leadership in technology strategy development and scientific excellence in heterogeneous micro/nano-electronics packaging, system integration and reliability.
2014 Madhavan Swaminathan
for significant and sustained contributions that have helped shape the design aspects of packaging in the areas of power delivery, System on Package (SOP) technologies and 3D Integration.
2013 Dongkai Shangguan
for 20 years of technical leadership, especially in the areas of of lead-free and environmentally conscious electronics and advanced microelectronics packaging and assembly technologies for product miniaturization and functional densification.
2012 Tseung-Yuen Tseng
for a decades-long record of developing and communicating packaging platform, material and process advancements through research and development leadership, publications and professional training.
for his accomplishments in multiple fields including optoelectronic packaging technology development, device and packaging materials development, electronic packaging and manufacturing technology development; and his leadership in the technology transfer of these developments from a research environment to an industrial commercialization and production environment.
2009 Moises Cases
for expertise in system level electrical packaging design and integration, including system level timing for high performance digital systems encompassing multiple boards and cable subsystems.
2008 Jianmin Qu
for his significant impact on the electronic packaging industry through 15 years of research and development in micro-electronic packaging, primarily in reliability modeling and analysis, resulting in one book, nine book chapters, 90 publications in refereed journals, and 110 conference presentations.
2007 Philip E. Garrou
for 25 years of technical contributions and leadership in thin film dielectric materials and microelectronic applications including multichip modules, bumping and wafer level packaging.
2006 Jorma Kivilahti
for contributions to the development of novel electronic and opticalintegration techniques and the reliability of electronic products.
2005 I. Charles Ume
for his contributions to thermomechanical reliability in electronic packaging.
2004 Luu T. Nguyen
for his major contributions in wafer level packaging, lead-free packaging, and for research collaboration and technology transfer in the area of electronic packaging.
2003 Thiam Beng Lim
for his leading edge research in advanced packaging technologies, and for managing and transferring the electronic packaging research and development to industry and other research organizations worldwide.
2002 Avram Bar-Cohen
2001 George Harman
2000 Ephraim Suhir
1999 Toshi Watari
1998 Kanji Otsuka
1996 Leonard Schaper
1995 C.P. Wong
(CHMT OUTSTANDING SUSTAINED TECHNICAL CONTRIBUTION AWARD)
1994 Takaaki Ohsaki
1993 Rao R. Tummala
1992 Peter M. Hall