Outstanding Young Engineer Award

Nomination Period Now Closed for 2019 Awards

Nomination Form

        Purpose:

To recognize outstanding contributions to the fields encompassed by the EPS through invention, technical development, publications, or new product implementation.

Award:

US$1,500 and Certificate

Basis for judging:

Technical contributions through patent invention, contributions to technology or product development within the EPS Field of Interest. May encompass management (directing) of significant new product introduction or implementation of major new electronic manufacturing processes; significantly increasing yield and/or reliability of established manufacturing processes. Contributions to the Society, through the BoG, Conferences, Chapters, etc., will also be considered. Proof of contributions may consist of open literature publications (preferred) such as papers, patents, books, and reports (available to the public). At least three (3) letters from peers and management at the nominee's place of employment attesting to the accomplishment(s) can be accepted in lieu of publications.

Eligibility:

 Recipient must be a current member of IEEE and EPS, and have been a member of IEEE and EPS for at least the past three years and renewed for the year of the Award.  Recipient must be less than 35 years of age on 31 December of the year before the award year.

See nomination form for full details.

 

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2019 RECIPIENT

Adeel Bajwa

Klicke and Soffa (K&S), USA

For his contributions to interconnects technology, both in fine-pitch and power electronics.

 

PAST RECIPIENTS

2018  No recipient

2017  Yan Liu

for outstanding contributions to the field of electronic packaging materials and nanotechnology through work in the superhydrophobic surface for energy and electronic applications, novel polymeric materials for advanced coating and electronic packaging. 

2016  No recipient

2015  Liangliang Li

for outstanding technical contributions to thermal interface materials and lead-free soldering materials through novel material synthesis and technology development, as well as service to the CPMT Society as organizer and Advisor of the CPMT Tsinghua University–Qing Hua Student Branch Chapter.

and

Jeffery C.C. Lo

for outstanding technical achievements in LED packaging development and component reliability assessment, and leadership within the CPMT Hong Kong Chapter.

2014 Yi Li

 for outstanding contributions to the field of electronic packaging materials and nanotechnology through work in the design, synthesis and characterization of polymericcomposite materials, especially conductive adhesives for electronic packaging.

2013  Dong Gun Kam

for development of a low-cost 60-GHz antenna-in-package solution that uses standard organic printed circuit board processes, and contributions to system-level signal integrity analysis, high-speed package design and signal integrity and EMI/EMC research.

2012  Mudasir Ahmad

for exceptional contributions to microelectronics packaging reliability design and assessment, and the CPMT Society.

 2011  Muhannad Bakir

 

for contributions to the advancement of 3D electrical, optical and thermal interconnect and packaging technologies, and to the professional and publication areas of the CPMT Society.

2010  Shaw Fong Wong

for his contributions in the area of component level solder joint reliability for flip chip packaging, as well as his development of a reliability degradation model for thermal interface materials.

2009  Madhusudan Iyengar

for exceptional and sustained technical innovations over the last five years that have resulted in cutting edge cooling technology and products with realizable benefits to the IT industry and its customers.

2008  Zhuqing Zhang 

for her outstanding contributions to the no-flow underfill process, most specifically for her invention of the double layer no-flow underfill and “nano-silica no-flow” underfill which eliminated the barrier of these applications in high performance driver packages.

2007  Myung J. Yim

for his outstanding contributions to the field of electronic packaging materials and technology through his numerous inventions and technical publications, and for services to the CPMT Society.

2006  Teck-Joo Goh 

for his contributions to microelectronic packaging research and technology development and for supporting CPMT Society activities and conferences.

and  Ravi Prasher

for contributions to thermal design and management of electronic packages, including micro-channel based cooling, nanofluidics, and thermal interface materials, and for supporting IEEE EPS activities and journals.

2005  Lara J. Martin

for her contributions to electronic product development, manufacturing, and reliability and for supporting CPMT Society activities and conferences.

2004  Daoqiang Lu

for his outstanding contributions to electrically conductive adhesives and advanced interconnect technologies and for supporting CPMT Society activities.

 and   Shijian Luo

for his outstanding contributions to underfills for flip chip packaging, and materials and processes for wafer level packaging and for supporting CPMT Society activities.

 and   Lei L. Mercado

for her outstanding contributions to the development of industry standards for electronic package reliability assessment, RF MEMS designs and copper low-k packaging and for supporting CPMT Society activities.

 2003  Emmanouil Tentzeris

 for his contributions to RF circuit design of high performance IC devices and to IEEE and CPMT Society sponsored conferences and activities.

 2002  Christine Kallmayer

  and

   Li Li

2001 Charles Wee Ming Lee

2000 Matt Schwiebert

1999 Corey Koehler

1998 Thomas Swirbel

1996 Michael S. Lebby