Bio Bar-Cohen - IEEE Electronics Packaging Society

Bio Bar-Cohen

Cohen

AVRAM BAR-COHEN (M’85,SM’87,F’93) Dr. Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, Life Fellow of IEEE, and an honorary member of ASME, currently serving as a Principal Engineering Fellow at Raytheon Corporation – Space and Airborne Systems. His publications, lectures, short courses, and research, as well as his US government and professional service in IEEE and ASME, have helped to create the scientific foundation for the thermal management of electronic components and systems. His current efforts focus on embedded cooling, including on-chip thermoelectric and two-phase microchannel coolers for high heat flux electronic components, thermal control of directed energy systems, and studies of wireless power beaming.

Bar-Cohen serves on the Board of Governors of the IEEE EPS, has represented the Society as a Distinguished Lecturer for more than 15 years, and is a past Editor-in-Chief of the CPMT Transactions (1995-2005). In 2014 he was honored by the IEEE with the prestigious CPMT Field Award and had earlier been recognized with the CPMT Society’s Outstanding Sustained Technical Contributions Award (2002), the ITHERM Achievement Award (1998) and the THERMI Award (1997). Bar-Cohen received the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008) and ASME’s Heat Transfer Memorial Award (1999), Edwin F. Church Medal (1994), and Worcester Reed Warner Medal (1990).

Bar-Cohen recently completed his service (2010-2016) as a Program Manager in the Microsystem Technology Office at the US Defense Advanced Projects Agency in Virginia. From 2001 to 2010 he served as the Chair of Mechanical Engineering and Distinguished University Professor at the University of Maryland and is currently on a leave-of-absence from that institution. From 1998 to 2001 he directed the University of Minnesota Center for the Development of Technological Leadership and held the Sweatt Chair in Technological Leadership. He is a past member of ASME’s Board on Professional Development and Board on Research and Technology Development, served a 3-year term as ASME VP of Research (1998-2000) and is also a past President of the Assembly of International Heat Transfer Conferences (2010-2014).

Bar-Cohen is the Editor-in-Chief of WSPC’s Encyclopedia of Thermal Packaging and the co-editor of WSPC’s “Advanced Integration and Packaging” book series. He has co-authored Dielectric Liquid Cooling of Immersed Components (WSPC, 2013), Design and Analysis of Heat Sinks (Wiley, 1995), and Thermal Analysis and Control of Electronic Equipment (McGraw-Hill, 1983), and has edited/co-edited another 28 books in this field.

He has authored/co-authored more than 400 journal papers, refereed proceedings papers, and chapters in books and has delivered some 100 keynote, plenary and invited lectures at major technical conferences and institutions. He holds 8 US and 3 Japanese patents and has advised to completion 70 master’s and PhD students at the University of Maryland, the University of Minnesota, and the Ben Gurion University (Beer Sheva, Israel), where he began his academic career in 1972.