Bio Eric Perfecto


ERIC PERFECTO has 34 years of experience working in the development and implementation of advanced packages. He is currectly Principal Member of the Technical Staff at GLOBALFOUNDRIES. Previously, he served as C4 Development Chief Technologist at IBM responsible for UBM and Pb-free solder definition for u-Pillar interconnect, and yield improvements in C4 and 3D wafer finishing.   His technical interests include flip chip, 2.5 & 3D fabrication, chip-package interaction, electromigration, multi-level Cu-Polymer wiring structures, and wafer level packaging. He holds a M.S. in Chemical Engineering from the University of Illinois and a M.S. in Operations Research from Union College. Eric has published over 80 external papers, including two best Conference Paper Awards (2006 ESTC and 2008 ICEPT-HDP) and the 1994 Prize Paper Award from CMPT Trans. on Adv. Packaging. He holds over 45 US patents, and has been honored with two IBM Outstanding Technical Achievement Awards (1998 and 2008), and an IBM Outstanding Contribution Award (2014). Eric was the 57th ECTC General Chair in Reno, NV, and the Program Chair at the 55th ECTC.  He is senior member of IEEE, IMAPS and Society of Plastic Engineers and a member of SHPE and SMTA. Eric is also an elected BoG member of CPMT Society of IEEE, where he serves as Awards Program Director, and a CPMT Distinguish Lecturer.