JEAN M. TREWHELLA (M’06) Ms. Trewhella received her B.S. in Physics from Antioch College (1987) and her M.S. in Applied Physics from Columbia University (1992). She joined the T.J. Watson Research Center, IBM, in 1988 where her work included polymer optical waveguides fabrication, electrical modeling, and opto-mechanical package design for data communication systems. In 2000 she created the High Speed Electrical and Optical Packaging Group in IBM Research directing work in electrical link signal integrity, advanced 1st and 2nd level packaging, and low cost high speed opto-mechanical packaging. She received an Outstanding Technical Achievement Award for her work on 10Gbps Ethernet Transceiver Development in 2003. In 2005 she drove IBM wide team of engineers and scientists to highlight key disruptive technologies synthesizing the messages into three GTO topics: Technology, Application-Optimized Systems, and Services 2.0. From 2006-2008 she was responsible for the Electronic Packaging Integration Group in IBM STG where her team developed the power5 and z10 system hardware. Currently Jean Trewhella is the Director of IBM Packaging Research and Development Center with responsibility of 3D, low cost, and high performance packaging technology for current and future products.
Ms. Trewhella was on the Strategic Advisory Board for NSF STC - Materials & Devices for Information Technology Research 2004-2008, she served as the General Chair of the 60th ECTC and is currently a member at large of the CPMT Board of Governors. She has authored numerous papers and holds over 20 US patents.