Bio Suhling

JEFFREY C. SUHLING (A’94, M’01)Jeffrey C. Suhling received his Ph.D. degree in Engineering Mechanics in 1985 from the University of Wisconsin. He then joined the Department of Mechanical Engineering at Auburn University, where he currently holds the rank of Quina Distinguished Professor and Department Chair. From 2002-2008, he served as Center Director for the NSF Center for Advanced Vehicle Electronics. He was appointed Department Chair of the Department of Mechanical Engineering in 2008.

His research interests include solid mechanics, stress and strain analysis, material characterization, experimental mechanics, advanced and composite materials, finite element analysis and computational mechanics. He works primarily on applications of these fields to electronics packaging, including silicon sensors for stress and temperature measurement, and materials characterization and constitutive modeling of microelectronic solders and encapsulants. Dr. Suhling has authored or co-authored over 600 technical publications, and he has advised over 100 graduate students at Auburn University. He is a Fellow of ASME, and is a member of IEEE, SMTA, IMAPS, SEM, ASTM, and TAPPI.

In ASME, Dr. Suhling served as Chair of the Electrical and Electronic Packaging Division during 2002-2003, and was on the EPPD Executive Committee from 1998- 2003. Dr. Suhling was the Technical Program Chair of the ASME InterPACK ‘07 Conference, and General Chair of the ASME InterPACK ‘09 Conference. He also served the InterPACK Conference Series as Finance Chair (2003), Track Chair for Modeling and Characterization (1999), Track Chair for Reliability (2005), and Honors and Awards Chair (2011). He was Associate Editor of the ASME Journal of Electronic Packaging from 2014-2019.

In IEEE, Dr. Suhling has been a member of the Electronics Packaging Society (formerly CPMT Society) for the past 30 years. He has served on the ECTC Program Committee (Applied Reliability) from 2003-present, and as Co-Chair of the ECTC Professional Development Course Committee from 2007-present. He was first elected to the IEEE Electronics Packaging Society Board of Governors in 2014, and has served as Member at Large (2014-2016), Director of Membership Services (2016-2018), and Vice President, Education (2019-present). Dr. Suhling has served in several roles in the ITherm Conference Series including Conference Program Vice Chair (2017), Conference Program Chair (2018), and Conference General Chair (2019). He is currently serving as Chair of the ITherm PDC Committee, and Co-Chair of the ITherm Best Paper Committee.