Bio: Jeffrey C. Suhling - IEEE Electronics Packaging Society

Bio Suhling

j suhling

JEFFREY C. SUHLING (A’94, M’01) received a B.S. degree in Applied Mathematics and Physics, and M.S. and Ph.D. degrees in Engineering Mechanics from the University of Wisconsin, Madison, WI. He joined faculty of the Department of Mechanical Engineering at Auburn University in 1985, where he currently holds the rank of Quina Distinguished Professor. Dr. Suhling co-established the NSF Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) in 1998, and served as Center Director from 2002- 2008. CAVE3 is a government and industry sponsored research center involving over 20 member companies, 15 faculty, and 35 graduate students that specializes in reliability of electronic packaging in harsh environments. In 2008, he was appointed Department Chair of the Department of Mechanical Engineering, which is the largest program at the University with over 1000 undergraduate students and 150 graduate students. He was selected “Outstanding Mechanical Engineering Faculty Member” by the undergraduate students during 1990, received the College of Engineering Birdsong Superior Teaching Award in 1994, and received the College of Engineering Senior Research Award in 2001. He has advised 75 graduate students at Auburn University, including 27 Ph.D. students and 48 M.S. students.

Dr. Suhling has been an active researcher in electronic packaging for over 25 years. His general areas of interest are in the mechanics and reliability of packaging. Specializations include silicon sensors for packaging stress and temperature measurements, stress effects in silicon devices, test chips, mechanical characterization of packaging materials including solders and polymers, solder joint reliability and aging effects, and finite element modeling. He has authored or co-authored over 375 technical publications, including 6 books and book chapters, 55 journal articles, and 325 conference proceedings papers. Six of his conference papers have been selected as the Best of Conference. These include Best Session Paper Awards at the 2005 and 2010 ECTC Conferences, as well as Best Paper Awards at the 1998 and 2002 IMAPS Annual Conferences, 2008 SMTA International, and 2013 InterPACK Conference. In addition, he and his co-authors have received Best Poster awards at the InterPACK 2007, InterPACK 2009, and InterPACK 2013 conferences.

Dr. Suhling is a member of IEEE/CPMT, ASME, IMAPS, and SMTA. In IEEE, he has served on the ECTC Applied Reliability program committee for the past 10 years. He was appointed to the ECTC Professional Development Course (PDC) program committee in 2006, and has served as Assistant Chair from 2008- Present. He has also been active in the IEEE/CPMT ITHERM Conference series, serving on the program committee for over 10 years. In ASME, Dr. Suhling served as Chair of the Electrical and Electronic Packaging Division (EPPD) during 2002-2003, and was on the EPPD Executive Committee from 1998- 2003. Dr. Suhling was the Technical Program Chair of the InterPACK ‘07 Conference, and General Chair of the InterPACK ‘09 Conference. He was elected a Fellow of ASME in 2009, and was recognized with the ASME-EPPD Mechanics Award for outstanding contributions to electronic packaging research.