Bio: Karlheinz Bock - IEEE Electronics Packaging Society

Bio Bock

photo kbock

KARLHEINZ BOCK (M’96) is since 2008 a Professor of Polytronic Microsystems at the faculty of Communication and Electronics Engineering at the University of Berlin.  He earned his Diploma on electrical and communication engineering from the University of Saarland, Saarbrücken, Germany in 1986. He worked as a materials scientist and as a systems analyst and consultant before he joined the University of Darmstadt, Darmstadt, Germany in 1989 where in 1994 he received his Dr.-Ing. (Ph.D.) for RF microelectronics. In 2012 he received the Doctor honoris causa of the Polytechnical University of Bukarest in Romania for his work on Polytronics.

Since 2001 he is employed as head of the Polytronic and Multifunctional Systems department at the Fraunhofer Institution for Modular Solid State Technologies in Munich working on advanced technology topics amongst them, thin silicon; thinning, dicing and handling and reliability of components; self-assembly of Si dies and other electronic components; super capacitances (super-Cap); foil and flexible electronics; organic electronics and sensors; 3D multifunctional and hetero-systems integration & packaging; MEMS acceleration sensors; medical electronics; implantable devices; biosensors with an annual research project volume of several Mio. €.

Karlheinz Bock has secured over € 50 Mio research funding and has been awarded more than 20 patents, and has published over 220 papers. He has given more than 50 invited presentations at universities, research institutions and international conferences and received the “Japan Society for Promotion of  Science (JSPS) Award” in 1994 for his PhD thesis. He co-authored 14 best paper awards amongst them the “He Bong Kim Award 2004” at CSMANTECH as well as at SPIE 2012, San Diego, USA and at MES 2012, Osaka Japan. Over the years he has been engaged in developing the technological community of 3D systems hetero-integration and packaging and organic and flexible electronics serving on many technical organizations and conferences. Amongst them he served on the emerging technology committee of the IEEE ECTC conference since 2008 as "Emerging Technologies" sub-committee member and vice chair (2011) and chair (2012). He also served on the ESTC 2012 technical program committee; since 2010 a jury member of the AMA Sensor Innovation Award in Germany and since 2012 as member of the AMA research council; since 2010 as conference co-chair for integrated smart systems ISS at Plastic Electronics in Dresden. Since 2013 he serves as the chair of the international advisor committee of the International Student Professional Contest “Interconnection technologies in Electronics” TIE in Romania. He has been active in different roles as committee member of IEDM since 2008 and in 2012 he served as the European arrangements chair of IEDM. He is active in the Board of Editors of the Micro-and Nanotechnology Journal of Bentham Science Publishers.