Bio Bock

KARLHEINZ BOCK (M’96)since 2014 has served as Professor and chair of electronics packaging and director of the institute of electronics packaging (IAVT) at the TU Dresden. Since 2008 he has served as a Professor of Polytronic Microsystems at the faculty of Communication and Electronics Engineering at the University of Berlin.  He earned his Diploma on electrical and communication engineering from the University of Saarbrücken, Germany in 1986 and his Dr.-Ing. (Ph.D.) for RF microelectronics from the University of Darmstadt, Darmstadt, Germany in 1994. From 1996 to 1999 he worked in the materials packaging and reliability department of IMEC vzw. in Leuven Belgium. He received the “Japan Society for Promotion of Science (JSPS) Award” in 1994 for his PhD thesis and worked as post-doc from 1994 to 1995 at the Tohoku University in Sendai, Japan.  He received two Doctor honoris causa, in 2012 from the Polytechnical University of Bukarest in Romania for his work on organic and flexible electronics and heterointegration and in 2019 from the Sikorsky-Polytechnical University of Kiew, Ukraine for his work in electronics packaging. Since 2017 he serves as a vice dean and since 2021 he serves as the dean of the faculty of electronics engineering and information sciences at the TU Dresden as well as in the rector of the TU Dresdens advisory boards for research and managing diversity as well as in the TU Dresden commission for environmental sustainability.

He served in the Fraunhofer Gesellschaft, from 2001 until 2014 where he has been employed as head of the Polytronic and Multifunctional Systems department at the Fraunhofer Institute for Reliability and Microintegration (IZM, Munich branch, from 2010 named EMFT) and as deputy director from 2006 until 2010 of IZM and from 2010 until 2012 as  acting director of Fraunhofer EMFT.

Karlheinz Bock has contributed more than 300 publications and more than 20 patents. He co-authored 16 best paper awards. (see Google Scholar and Research Gate) He is engaged in developing the technological community of 3D systems, heterosystem integration and packaging and organic and flexible electronics, advanced packaging and reliability. He serves on the emerging technology TPC of IEEE ECTC since 2008, as sub-committee member and vice chair 2011 and chair 2012; as member of IEEE IEDM since 2008 on TPC for display sensors MEMS (DSM) and as chair of DSM TPC in 2010; as the European arrangements co-chair 2011, chair 2012 of IEEE IEDM executive committee; furthermore he served on the IEEE ESTC conference technical program committee since 2012; 2016 he has served as the program chair of  IEEE ESTC 2016 and as the general chair of IEEE ESTC 2018. Since 2015-2018 he served as vice chair and from 2018-2020 as chair of the technical committee of emerging technologies of the IEEE EPS. Since 2020 he serves on the IEEE EPS ECTC executive committee and as a program chair of IEEE ECTC 2022 and at present as the vice general chair of ECTC2023. Since 2014-2018 and re-elected from 2020 he serves on the board of governors BoG of IEEE EPS for region 8.