Bio Keser

Keser

BETH KESER, Ph.D. (M’99,SM’10), a recognized global leader in the semiconductor packaging industry with over 19 years of experience, received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 15 patents, 8 patents pending, and over 40 publications in the semiconductor industry. Based in Munich, Germany, Beth leads the Wireless Packaging Solutions Department at Intel Corporation in the iCDG Business Unit. 

Previously, Beth led Qualcomm’s Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group for over 7 years where her team qualified over 50 products resulting in over 7 billion units shipped--technology consumers around the world enjoy in cell phones today.  

Before joining Qualcomm in 2009, Beth was instrumental in developing 2 packaging technologies during her career at Motorola and Freescale Semiconductor. Beth led the Wafer-Level Chip Scale packaging team at Motorola, which included directing the activities of process engineering, package characterization, package reliability, and mechanical modeling.  In addition, Beth was the lead technologist and manager of the Redistributed Chip Packaging Technology (RCP). She led the team that developed this technology for 6 years and filed 6 patents on this technology. 

Beth has been IMAPS Device Packaging Conference Technical Chair 2006-2009, IMAPS Flip Chip/CSP Sub-committee member 2000-2009 and chair 2005-2008, and SMTA’s International WLP Conference WLP Track Chair 2010-2011. Beth has taught a Professional Development Course on Fan-Out Wafer Level Packaging at conferences since 2015.

Beth is an IEEE Senior Member whose volunteer activities and professional society responsibilities include: ECTC Executive Committee 2010-17, ECTC Advanced Packaging Sub-committee member 2000-present, and has co-authored 16 papers (2000-1, 2003, 2007-8, and 2011-17) at ECTC. Beth is also an IEEE EPS Distinguished Lecturer who chaired IEEE EPS’s 65th Electronic Component and Technology Conference. Beth is currently IEEE CMPT’s VP of Education.