Bio Kwang-Lung Lin

Prof. KWANG-LUNG LIN is a Professor at the Department of Materials Science and Engineering of National Cheng Kung University, Tainan, Taiwan. Prof. Lin’s research interests focused on surface modification, interconnect materials and technologies for electronic packaging. Subjects of his research are related with 3D IC technology, flip chip technology, solder bumping, Pb-free solders, soldering behavior, wire bonding, interfacial interaction, electromigration (EM) and microstructure variation. Prof. Lin has published more than 200 international journal papers, given more than 90 presentations in international conferences, been awarded 16 patents from Japan, Taiwan, and USA.  He has been actively involved in academic activities of TMS and IEEE-CPMT societies in organizing/co-organizing conferences, chairing sessions. He has received several awards and recognitions including IEEE Fellow, MRS-T (Taiwan) Fellow, NCKU Chair Professor, and ASE Chair Professor.