Bio Li
LI LI (M’09-SM’09) is a Distinguished Engineer at Cisco Systems, Inc. where he leads an initiative on 3D IC integration and advanced packaging development. He has been with Cisco for 12 years and has 20 years industry experience in IC packaging design, technology development and qualification.
He is responsible for developing advanced semiconductor and packaging technologies to enable Cisco’s computing and networking products including the industry leading CRS, NCS and Nexus families of routing and switching products. He was promoted to a Cisco Distinguished Engineer in 2008 for his outstanding contributions in advanced technology and supply chain development.
Dr. Li began his career at IBM as an Advisory Engineer. He was part of the team who developed the industry first Flip Chip Plastic Ball Grid Array (FC-BGA) for fast SRAM applications. He led a cross-functional team to develop an optoelectronics package for Philips Electronics’ Liquid Crystal on Silicon (LCOS) devices before joining Cisco System in 2004.
He is the author of several book chapters and over 50 technical papers in the field of microelectronics packaging and currently holds 12 US patents. His technical interests include design and manufacturing of advanced packaging and interconnect products, device and package level reliability analysis, 2.5D / 3D IC integration, and System-in-Package.
Dr. Li is a Senior Member of IEEE. He served as a member of the CPMT Board of Governors (BoG) from 2013 to 2016. He was the chair of the Interconnections Committee for the IEEE Electronic Component Technology Conference (ECTC) and has been a member of the ECTC Program Committee since 2007. He was awarded a CPMT Volunteer Award for his contributions to the ECTC programs for the past 10 years.
Currently Dr. Li co-chairs the SEMI Advanced Packaging Committee and was instrumental in organizing the Advanced Packaging Forum – a program co-hosted by CPMT at the SEMICON West for the past several years. He is on the Advisory Board of the ConFab and has been organizing the Advanced Packaging Session – another program sponsored by CPMT. He represents Cisco on the JEDEC committees and is a member of the Board of Directors at HDP User Group International (HDPUG). He is active in the working groups at the Global Semiconductor Alliance (GSA). He volunteers to non-profit organizations including Habitat for Humanity and Resource Area for Teaching (RAFT).
He received his M.S. and Ph.D. degrees in Mechanical Science and Engineering from the University of Illinois at Urbana-Champaign.