Bio McCann

McCann

DAVID MCCANN (M’89) is the VP of Technology for the Electronics Packaging Society.  David was a member of the ECTC Executive Committee for 10 years and later participated on the ECTC Steering Committee for two years.

David is currently Sr. VP, Chief of Staff, Business Unit at Amkor Technology in Tempe, AZ.  Prior to this role, he was at Rockley Photonics in Pasadena, CA for three years where he led packaging development for medical sensors and communications transceivers.  Prior to Rockley Photonics, David was at GlobalFoundries for eight years where he was Vice President of Post Fab Development and Operations.   He was responsible for GlobalFoundries internal bump and probe factories, for packaging and test development for Global’s Foundry, ASIC, and RF businesses, for OSAT partnerships, supply chain qualification and external bump-probe-assembly-test production.  He led the Post Fab process and business integration between GlobalFoundries and IBM, and later was part of the team that transitioned the ASIC business to Marvell.  He was based in Malta, New York.

Prior to GlobalFoundries, David was at Amkor Technology for 11 years leading flip chip technology development and the flip chip business unit.  Amkor is a leading OSAT (Outsourced Assembly and Test) company, with factories across Asia.  His technology and business focus was primarily on HPC, mobile, MEMS, and gaming packaging.

Prior to Amkor, David was at Biotronik GmbH, a pacemaker and implanted defibrillator supplier for 10 years, in product development, process development, and operations leadership roles.