IEEE Electronics Packaging Society IEEE Electronics Packaging Society

Bio Orii

Orii photo

Yasumitsu Orii (M’12) received the B.S. in Material Science from the Osaka University, Japan and the Ph.D. from the Osaka University, Japan as well.

Dr. Yasumitsu Orii joined IBM Japan in 1986 and is a leading expert on Flip Chip organic packages, which have contributed to the performance improvements and miniaturization of such products as servers, laptop computers, and HDDs. The packaging technology is becoming more important for next generation server products as Moore’s Law reaches its limits. His flip chip expertise extends into many related areas. Initially, he was a pioneer of flip chip on FPC (Flexible Printed Circuit) for HDDs, which allowed the read/write amplifier ICs to be mounted on the suspension and much closer to the GMR head. Later, he developed the C2 (Chip Connection) technology that supported low-cost 50-μm-pitch flip chip bonding for the commodity consumer electronics market and it was licensed to a company in Taiwan.

 Currently he is a senior manager of IBM Research Tokyo Science & Technology division and a Senior Technical Staff Member as well as IBM Academy member is leading the next generation flip chip organic package, 3D-IC projects and Neuromorphic Computing at IBM Research Tokyo for IBM Servers and creating new technologies under a Joint Development Program involving many leading Japanese materials companies.

 Dr.Yasumitsu Orii has served co-chair of IEEE EPS High Density Substrates & Boards and ECTC CPMT Seminar since 2015 and he is the board member of IEEE EPS Japan Chapter. And he has contributed to ICSJ(IEEE EPS Symposium Japan) as an invited speaker since 2012.

He received Best Paper Award at the 2008 ICEPS (International Conference on Electronics Packaging) , Outstanding Paper Award at the IMPACT 2011, JIEPS Annual Best Paper award in 2011 , IMAPS Sidney J. Stein International Award in 2012, JIEPS Annual technical award in 2014 and IMAPS Fellow award in 2015. And he had been the chair of Technical Program Committee in ICEPS 2009-2011 responsible for technical program editing and paper selection. He was the general chair of ICEP-IAAC(IMAPS All Asia Conference) 2012 in Tokyo.