Bio Perfecto

ERIC PERFECTO (M’95, SM’01, F’17) has extensive experience working in microelectronics. At IBM, Eric has led the development of multi-level Cu-polyimide advanced packages for high-end systems, followed by the introduction of Pb-free solder interconnects and 2.5D wafer finishing. As part of the IBM Microelectronics Division divestiture, Eric moved to GLOBALFOUNDRIES where he established a Si Photonics packaging development line. In 2019 he returned to IBM part time to establish a heterogeneous integration line in Albany. He holds a M.S. in Chemical Engineering from the University of Illinois and a M.S. in Operations Research from Union College.

An author of more than 80 technical papers and three book chapters, Eric received two Best Conference Paper Awards (2006 ESTC and 2008 ICEPT-HDP) and the 1994 Prize Paper Award from CPMT Trans. on Adv. Packaging. He holds 55 US patents and has been honored with two IBM Outstanding Technical Achievement Awards.

Eric served as the 57th ECTC General Chair, the 55th ECTC Program Chair and is the current ECTC Publicity chair. For the last 12 years, Eric’s popular Flip Chip Fabrication and Interconnection course has been given at ECTC to great reviews. He is an EPS Distinguish Lecturer, an IEEE Fellow, and has achieved IMAPS and SPE senior membership. 

Eric has represented the EPS members previously, elected 4 times to the BoG. For 3 years he served as the EPS Strategic Director of Global Chapters and Membership where he focused on enhancing the EPS membership value.  Through his efforts, the CPMT Transactions are now part of the EPS membership. For 8 years, he was the EPS Awards Program Director responsible for the EPS Mayor Awards, the Regional Awards, the PhD Fellowship, the ECTC Student Travel Awards and the ECTC Volunteer Award.  Currently, he chairs the EPS Field Award committee. At a local level, Eric is the membership Chair of the Mid-Hudson IEEE Section and founding member of the EPS Mid-Hudson EPS Chapter where he serves as membership chair.