PHILIP GARROU (M'88, SM'92, F'00) consults in the areas of thin film technology, IC packaging and interconnect, microelectronic materials and 3D IC integration for startups and fortune 500 companies. From 2002 – 2004 he was Global Director of Technology and New Business Development for Dow Chemicals Advanced Electronic Materials business. From 1997 – 2002 he was General Manager of Dows BCB dielectric business.
Dr. Garrou is a fellow of both IEEE and IMAPS and has served as President of the IEEE Components, Packaging and Manufacturing Technology Society, CPMT (2004-2005) and IMAPS (1998). Dr. Garrou has been Associate Editor of IEEE Transactions on Components and Packaging. He is currently Contributing Editor and blogger (“Insights from the Leading Edge”) for Solid State Technology. He has authored / co-authored > 100 technical publications. He edited and authored the Multichip Module Handbookfor McGraw Hill in 1998 and the Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuitsfor Wiley-VCH, (Vol 1&2) 2008; (Vol 3) 2014.
In 1994 he won the Milton Kiver Award for Excellence in Electronic Packaging and Production for the commercial introduction of CycloteneÔ Advanced Electronics Resins.
In 2000 he won the IMAPS William Ashman award for “…technical achievement in Microelectronics Packaging”. In 2002 he won the Fraunhofer IZM International Adv Packaging Award for “..pioneering achievement in the introduction of new thin film polymeric packaging materials.” In 2007 he won the IEEE EPS Sustained Technical Achievement Award for “..for 25 years of technical contributions and leadership in thin film dielectric materials and microelectronic applications including multichip modules, bumping and wafer level packaging, integrated passives and 3D integration”
Dr. Garrou received his B.S. degree in Chemistry from North Carolina State University (1970) and his PhD degree in Chemistry from Indiana University (1974).