Bio Thompson - IEEE Electronics Packaging Society

Bio Thompson

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PATRICK THOMPSON (M’87, SM’92) earned his BS, MS and PhD degrees in Chemical Engineering at the University of Missouri-Rolla. He has more than 25 years of experience  in advanced packaging research, development and transfer to manufacturing, contributing to  technologies ranging from flip chip fabrication and packaging, flip chip on board and chip scale packages, to multi-chip packaging, MEMS, optoelectronic packaging, and high performance portable packaging. He has led teams at Bell Labs, AMI Semiconductors , and Motorola (now Freescale). Since 2001, he has been a Senior Member of the Technical Staff at Texas Instruments, where he currently leads fine  pitch Cu pillar interconnect and TSV packaging technology development.

Pat is active in industry-consortia and industry-university partnerships, including mentoring SRC custom projects and PhD students.

Pat has five patents and over two dozen publications. He has presented packaging tutorials and given invited talks at leading packaging conferences. He is a member of the Electronic Components and Packaging Technology Conference technical program committee, where he has held multiple positions, including General Chair of the 2006 ECTC, and is now the Financial Chair. He has served at both the local and Society level of the CPMT holding positions including Member-at-Large of the Board of Governors, Administrative Vice President, and Technical Vice President of the CPMT.

Pat has applied his interest in professional education and training and industry-academia interactions in CPMT as a member, and current chair of the Awards Committee. He instituted the CPMT Student Travel Award, and leads the search for and recognition of outstanding packaging professionals through the CPMT major awards. He is also a member of the ECTC Advisory Committee and the CPMT Field Award search team.