WILLIAM T. CHEN (M'92, SM‘03, F'06) received his engineering education at University of London (B.Sc), Brown University (M.Sc) and Cornell University (PhD). He joined IBM Corporation at Endicott New York in 1963.
At IBM he worked in a broad range of IBM microelectronic packaging products. He received IBM Division President Award for his leadership and innovation in Predictive Modelling on IBM products. He was elected to the IBM Academy of Technology for his contributions to IBM Products and Packaging Technologies. He retired from IBM in 1997. He joined the Institute of Materials Research and Engineering (IMRE) in Singapore, to initiate research in microelectronic packaging materials and processes. He was appointed to the position Director of the Institute (IMRE) steering the growth in people, funding and research facilities and research direction for IMRE to become the leading materials science and engineering research center in the ASEAN region. In 2001 he joined ASE Group, where he holds the position of ASE Fellow and Senior Technical Advisor. In this assignment he has responsibilities for guidance to technology strategic directions for ASE Group.
He is Senior Past President of the IEEE/CPMT Society. He is the Co-Chair of the ITRS Assembly and Packaging Roadmap Technical Working Group. He is chair of the Semicon West Packaging Committee. He has been elected to a member of the iNEMI Board. He is a member of the Technology Committee of GSA.
He has been elected to Fellow of IEEE and Fellow of ASME. He has served as an Associate Editor of ASME Journal of Electronic Packaging, and IEEE/CPMT Transactions.