Bio Wong - IEEE Electronics Packaging Society

Bio Wong

Wong

C. P. WONG (SM’87,F’92) Prof. C. P. Wong is currently Dean of the Faculty of Engineering at the Chinese University of Hong Kong. He is on a no pay leave from the Georgia Institute of Technology(GT) where he is a Regents’ Professor and the Charles Smithgall Institute- Endowed Chair at the School of Materials Science and Engineering. He received his B.S. degree from Purdue University, and his MS. and Ph.D. degrees from the Pennsylvania State University. After his doctoral study, he was awarded a two-year postdoctoral fellowship with Nobel Laureate Professor Henry Taube at Stanford University.  Prior to joining GT in 1996, he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992 for his seminal contributions to low-cost high-performance packaging of semiconductor devices and components.

His research interests lie in the fields of polymeric electronic materials, electronic, photonic and MEMS packaging and interconnect, interfacial adhesions, nano-functional material syntheses and characterizations, nano-composites, such as well-aligned carbon nanotubes, graphenes,  high performance electrical conductive adhesives, ultra high k capacitor composites, lead-free alloys, flip chip underfills, and novel lotus effect coating materials.

 He received many awards, among those, the AT&T Bell Labs Fellow Award in 1992 (the most prestigious Technical Award bestowed by Bell Labs), the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE Educational Activities Board Outstanding Education Award in 2001, the IEEE EPS Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award (the highest award bestowed by GT to a faculty) in 2004, named holder of the Charles Smithgall Institute-Endowed Chair Professor (holder of one of the two GT Institute-Endowed Chairs) in 2005, the GT Outstanding BS and PhD Thesis Advisor Awards, the IEEE Components, Packaging and Manufacturing Technology  Field Award in 2006 (hailed by the IEEE as “Father of Modern Semiconductor Packaging”), the Sigma Xi’s Monie Ferst Outstanding Educational Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the IEEE EPS David Feldman Award and the Pennsylvania State University Distinguished Alumni Award in 2009.

 Prof. Wong served as CPMT Society President in 1992 and 1993, and is currently Chair of the CPMT Society Fellow Evaluation Committee.

 He holds over 50 U.S. patents, and has published over 1,000 technical papers, co-authored and edited 10 books and is a member of the National Academy of Engineering of the USA since 2000.