Conference Calls for Papers

The Conferences and Workshops listed here are accepting submissions.

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2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Shanghai, China
Abstract Submission Date: Mar 12, 2018
Aug 8, 2018 - Aug 11, 2018
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
Melaka, Malaysia
Abstract Submission Date: Mar 31, 2018
Sep 4, 2018 - Sep 6, 2018
2018 13th International Congress Molded Interconnect Devices (MID)
Würzburg, Germany
Abstract Submission Date: Feb 28, 2018
Sep 25, 2018 - Sep 26, 2018
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Stockholm, Sweden
Abstract Submission Date: Apr 10, 2018
Sep 26, 2018 - Sep 28, 2018
2018 IEEE CPMT Symposium Japan (ICSJ)
Kyoto, Japan
Abstract Submission Date: May 25, 2018
Nov 19, 2018 - Nov 21, 2018
2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Hong Kong
Abstract Submission Date: Jul 31, 2018
Dec 17, 2018 - Dec 20, 2018