Conference Calls for Papers - IEEE Electronics Packaging Society

Conference Calls for Papers

The Conferences and Workshops listed here are accepting submissions.

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2018 20th International Conference on Electronic Materials and Packaging (EMAP)
Hong Kong
Abstract Submission Date: Aug 31, 2018
Dec 17, 2018 - Dec 20, 2018
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Hannover, Germany
Abstract Submission Date: Oct 30, 2018
Mar 24, 2019 - Mar 27, 2019
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Toulouse, France
Abstract Submission Date: Nov 17, 2018
Apr 24, 2019 - Apr 26, 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
Las Vegas, NV USA
Abstract Submission Date: Oct 19, 2018
May 25, 2019 - Jun 2, 2019
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Las Vegas, NV USA
Abstract Submission Date: Sep 3, 2018
May 29, 2019 - May 31, 2019