Conference Calls for Papers

The Conferences and Workshops listed here are accepting submissions.

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2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Hannover, Germany
Abstract Submission Date: Oct 30, 2018
Mar 24, 2019 - Mar 27, 2019
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)
Toulouse, France
Abstract Submission Date: Nov 17, 2018
Apr 24, 2019 - Apr 26, 2019
2019 IEEE Holm Conference on Electrical Contracts
Milwaukee, WI USA
Abstract Submission Date: Feb 8, 2019
Sep 14, 2019 - Sep 18, 2019
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Pisa, Italy
Abstract Submission Date: Jan 15, 2019
Sep 16, 2019 - Sep 19, 2019