Distinguished Lecturer Program

EPS Vice President, Education: Eric Perfecto

EPS Distinguished Lecturers are selected from amongEPS Fellows, Award winners, and Society leaders, who are members of the technical community and experts in their field.They are available to present lectures and/or courses at EPS events – Chapters, Conferences, Workshops or Symposia; as well as IEEE Student Chapter events.EPS Chapter events are given priority.

The EPS may provide travel assistance directly to the Lecturer when requested and approved. Availability is determined by the Lecturer, based on his/her schedule.All events must receive approval from the EPS VP, Education prior to final commitment.

The EPS Distinguished Lecturer Program (DLP) aims at serving communities interested in the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and micro-electronic systems for all electronic applications.

Lecturers will tailor their presentations to the intended audience. The DLP strives to support EPS Chapters worldwide by helping them to invite leading researchers in their respective fields and IEEE Student Chapters to encourage students to pursue EPS related fields and to join the EPS society.

Requests for lectures given by one of the EPS Distinguished Lecturers (DL) must be submitted by the Chapter Chairs or the Conference/Workshop/Symposium Chair via the online DL Program Request form according to the procedure described below.

DL lectures (live or virtual) which are recorded should be place in the EPS Resource Center by obtaining a signed Webinar Consent form.

Attendees of DL talks can receive Professional Development Hours (PDH) by completing the survey.

DL Program Guidelines, Policies, Procedures

DL Presentation Templates

DL Program Request Form

Create Concur/IEEE Account for Expenses

Concur Travel Expense Reporting

Concur Tutorial

Concur FAQs and Information

DL Post Event Survey

If you are interested in nominating an EPS Distinguished Lecturer, please contact the EPS Vice President, Education:Eric Perfecto


EPS Distinguished Lecturers

 

Ramachandra Achar, Ph.D. (7/1/2020 - 6/30/2024)

Department of Electronics, Carleton University

Ottawa, Ontario, CANADA

Topics: CAD tools and methodologies for interconnects, packages, and systems with an emphasis on signal, power and EMI integrity

 

Mudasir Ahmad (1/2022 -12/2025)

Google

CA, USA

Topics:Internet of Things (IoT), Advanced Packaging, 2.5D, Heterogeneous Silicon Photonics, Advanced Reliability (Thermomechanical, Mechanical Shock), Numerical Modeling, Advanced Thermal Solutions, Stochastic Analysis, Bayesian Inference, Machine Learning, Artificial Intelligence

 

Kemal Aygün, Ph.D. (7/1/2020 - 6/30/2024)

Intel Corporation

Chandler,AZUSA

Topics: Package/socket/board/interconnect technologies, electrical simulation methodology and lab metrologies

 

Muhannad Bakir, Ph.D. (1/2024 - 12/2027)

School of Electrical and Computer Engineering

Georgia Institute of Technology

Atlanta, GA USA

Topics: Emerging interconnection architectures and technologies; heterogeneous system design and integration

 

W. Dale Becker, Ph.D. (7/1/2020 - 6/30/2024)

Retired

Hyde Park, NYUSA

Topics: Electronic Package design and integration, system design, electrical modeling tools

 

Wendem Beyene, Ph.D. (7/1/2020 - 6/30/2024)

Meta

San Jose, CA

Topics: Electrical modeling and simulation techniques for analysis of interconnects, packages, and systems.Machine learning techniques

 

Karlheinz Bock, Ph.D.  (7/2020-7/2024)

Technische Universität Dresden

Dresden, Germany

Topics:Multifunctionality & heterosystemintegration & additive manufacturing (IoT, Industry 4.0, tactile internet), packaging for mechanical, digital and power co-integration (automotive, machines, robots..),2.5D and 3D electro-optical-RF interposer and board (high performance), heterointegration for flexible, bio, organicand large area electronics (open form factor)

 

Bill Bottoms, Ph.D. (6/2021 – 6/2025)

Third Millennium Test Solutions

Santa Clara, CAUSA

Topics: Heterogeneous Integration, Semiconductor test technology, Emerging research materials, Packaging of electronic components and systems, the global network and its future requirements, the internet of things and Smart manufacturing

 

Chris Bower, Ph.D. (6/2021 – 6/2025)

X-Celeprint Inc.

North Carolina, USA

Topics: Novel assembly methods, elastomer stamp micro-transfer-printing, heterogeneous integration, three-dimensional integration, manufacturing of micro-assembled displays and other large-format electronics.

 

Tanja Braun, Ph.D. (7/2023 – 6/2027)

Fraunhofer IZM

Berlin, Germany

Topics:Advanced Packaging, Heterogeneous Integration, Flip Chip, Chiplet, Fan-out Wafer and Panel Level Packaging.

 

William T. Chen, Ph.D. (1/2024 -12/2027)

ASE (U.S.) INC

Santa Clara, CAUSA

Topics: Semiconductor and Electronics Industry Trends and Roadmap

 

Kuan Yew Cheong, Ph.D. (1/2024 -12/2027)

School of Materials and Mineral Resources Engineering

Universiti Sains Malaysia

Topics: Materials, Physical Failure Analysis

 

Xuejun Fan, Ph.D. (1/2024 - 12/2027)

Department of Mechanical Engineering

Lamar University

Beaumont, TX USA

Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems

 

Madhu Iyengar, Ph.D. (7/1/2020 - 6/30/2024)

Google

Mountain View, CA, USA

Topics: Thermal component and system design for packages, servers, and data centers.

 

Subu Iyer, Ph.D. (6/2021 - 5/2025)

University of California, Los Angeles

Los Angeles, CA USA

Topics:Heterogeneous Integration; Flexible hybrid electronics; 3D interposer, and wafer scale integration and stacking.

 

Beth Keser, Ph.D. (1/2024-12/2027)

Zero ASIC

San Diego, CA USA

Topics:Fan-Out Wafer Level Packaging and Wafer Level Packaging structures; processes, materials, tools, design rules and roadmaps; Advanced Packaging; Introduction to Packaging; and photoimageable liquid polymer filmsFan-Out Wafer Level Packaging and Wafer Level Packaging structures; processes, materials, tools, design rules and roadmaps; photoimageable liquid polymer films.

 

Pradeep Lall, Ph.D. (1/2024 - 12/2027)

Auburn University

Auburn, AL USA

Topics: Semiconductor Packaging, Modeling and Simulation, Reliability in Harsh Environments, Shock/Drop/Vibration, Cu Wirebonding, Flexible Hybrid Electronics, Additive Manufacturing, Prognostics and Health Management, LEDs, Micro CT Measurements

 

John H. Lau, Ph.D. (1/2024 - 12/2027)

Unimicron Technology Corporation

Palo Alto, CA USA

Topics: Electronics and Photonics 2D and 3D packaging and manufacturing

 

Ravi Mahajan, Ph.D. (7/2020 - 6/2024)

Intel Corporation

Arizona, USA

Topics: Advanced Packaging Architectures, Assembly Processes and Thermal Management

 

James E. Morris, Ph.D. (1/2024 -12/2027)

Department of Electrical and Computer Engineering

Portland State University

Portland, Oregon USA

Topics: Electrically conductive adhesives; Electronics packaging; Nanotechnologies

 

Rajen Muguran, Ph.D. (7/2022 - 6/2026)

Texas Instruments

Dallas, TX, USA

Topics:Multiphysics and System Co-Design modeling for complex analog and mixed-signal packaging, mmWave/THz signal integrity, power electronics packaging, and System-Level EMI/EMC modeling, analysis, and characterization.

 

Katherine "Kitty" Pearsall, Ph.D. (7/2024-6/2027)

President of Boss Precision Inc.

Independent Consultant

Austin, TX USA

Topics:Supply chain, component qualification and end quality; Leadership

 

Eric D. Perfecto (1/2024-12/2027)

IBM Research

Poughkeepsie, NY USA

Topics:Fine pitch interconnect, chip to chip and chip to laminate connection, UBM and solder selection, chip package interaction and 2.5D fabrication

  

Mark Poliks, Ph.D. (1/2024 – 12/2027)

Binghamton University (SUNY)

Binghamton, NY USA

Topics: Materials and Processes, Advanced Manufacturing, Flexible Hybrid Electronics, High Speed and Additive

 

 Gamal Refai-Ahmed, Ph.D. (7/1/2022 - 6/30/2026)

Xilinx

San Jose, CA USA

Topics: Thermo-mechanical Semiconductor and Electronics Industry Roadmap and directions, Advanced holistic Thermo-mechanicalsolution, assembly and reliability ofHeterogeneous Packagingand Silicon Photonics, Future thermo-mechanical technology, architecture for component and system

 

Katsuyuki Sakuma, Ph.D. (7/1/2024 - 6/30/2027)

IBM T.J. Watson Research Center; Visiting Professor at Tohoku University, Japan

New York, NY USA

Topics:3D integration technologies, bonding technologies, advanced packaging, and biomedical sensors

 

Jose Schutt-Aine, Ph.D. (7/1/2024 - 2/2027)

University of Illinois

Champaign, IL USA

Topics:High-Frequency Measurements, Mixed-Signal Design, High-Performance Computing, electromagnetic Modeling, Signal Integrity, CAD Tools for Interconnects and Packages, Machine Learning for High-Speed System Modeling

 

John Shalf, 1/2024 - 12/2027)

Lawrence Berkeley National Laboratory

Berkeley, CA USA

Topics: HPC System Integration, System Integration, Photonics and Packaging

 

Dongkai Shangguan, Ph.D. (7/1/2023 - 6/30/2027)

Thermal Engineering Associates, Inc.

San Jose, CA USA

Topics: Heterogeneous Integration and SiP; Electronics Packaging and Miniaturization; Materials; Thermal management; Reliability; Electronics manufacturing technology; Flexible hybrid electronics

 

Rohit Sharma, Ph.D. (1/2023 - 12/2026)

Indian Institute of Technology Ropar

Punjab, India

Topics:Design of High-speed Graphene-based and 2D materials-based nanoelectronics; Electrical-Thermal co-design of electronic packages and microsystems; Application of Machine Learning in design and analysis of interconnects; Heterogeneous integration.

  

Ephraim Suhir, Ph.D. (1/2024 -12/2027)

Los Altos, CA 94024 USA

Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations

 

Andrew Tay, Ph.D. (1/2023-1/2027)

SHINE Center, National University of Singapore

Singapore

Topics: Thermomechanical reliability of microelectronics packages; Thermal and failure analysis of microelectronic devices; Thermal management of electronic and EV battery systems; Solder joint reliability; Delamination and fracture; Moisture effects; Modelling and simulation.

 

Manos Tentzeris, Ph.D. (7/1/2023 - 6/30/2027)

Georgia Institute of Technology

Atlanta, GA USA

Topics: RF/mmW/3D/electronics industry/nanotechnology/materials/packaging/3D printing/energy harvesting-zero power

 

Rao Tummala, Ph.D. (1/2024 -12/2027)

Microsystems Packaging Research Center (PRC)

Georgia Institute of Technology

Atlanta, GA USA

Topics: Electronics Packaging

 

E. Jan Vardaman (1/2024-12/2027)

TechSearch International, Inc.

Austin, TX USA

Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; drivers in advanced packaging; Flip chip and wafer level packaging

 

Paul Wesling (1/2024 -12/2027)

Saratoga, CA USA

Topics:Origins of Silicon Valley and the Electronics Packaging Society; the IEEE/SEMI/ASME Heterogeneous Integration Roadmap and how to use it (as editor for the 2019 Roadmap).