Distinguished Lecturer Program

EPS Vice President, Education: Jeff Suhling

EPS Distinguished Lecturers are selected from among  EPS Fellows, Award winners, and Society leaders, who are members of the technical community and experts in their field.  They are available to present lectures and/or courses at EPS events – Chapters, Conferences, Workshops or Symposia; as well as IEEE Student Chapter events.  EPS Chapter events are given priority.

The EPS may provide travel assistance directly to the Lecturer when requested and approved. Availability is determined by the Lecturer, based on his/her schedule.  All events must receive approval from the EPS VP, Education prior to final commitment.

The EPS Distinguished Lecturer Program (DLP) aims at serving communities interested in the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and micro-electronic systems for all electronic applications.

Lecturers will tailor their presentations to the intended audience. The DLP strives to support EPS Chapters worldwide by helping them to invite leading researchers in their respective fields and IEEE Student Chapters to encourage students to pursue EPS related fields and to join the EPS society. The DLP talk is a major event in the life of the inviting Chapter.

Requests for lectures given by one of the EPS Distinguished Lecturers (DL) must be submitted by the Chapter Chairs or the Conference/Workshop/Symposium Chair via the online DL Program Request form according to the procedure described below.

DL Program Guidelines, Policies, Procedures

DL Presentation Template

DL Program Request Form

Create Concur/IEEE Account for Expenses

Concur Travel Expense Reporting

Concur Tutorial

Concur FAQs and Information

DL Travel Expense Reimbursement Form

DL Post Event Survey

EPS Distinguished Lecturers

Mudasir Ahmad (6/2017-6/2021)
Cisco Systems, Inc. 
San Jose, CA USA
Topics:  Internet of Things (IoT), Advanced Packaging, 2.5D, Heterogeneous Silicon Photonics, Advanced Reliability (Thermomechanical, Mechanical Shock), Numerical Modeling, Advanced Thermal Solutions, Stochastic Analysis, Bayesian Inference, Machine Learning, Artificial Intelligence


Muhannad Bakir, Ph.D. (6/2015-6/2019)
School of Electrical and Computer Engineering
Georgia Institute of Technology
Atlanta, GA USA
Topics: Emerging interconnection architectures and technologies; heterogeneous system design and integration


Avram Bar-Cohen, Ph.D.  (1/2015-1/2019)
Department of Mechanical Engineering
University of Maryland
College Park, Maryland  USA
Topics: Thermal packaging


Karlheinz Bock, Ph.D. (6/2016-6/2020)

Technische Universität Dresden
Dresden, Germany

Topics:  Multifunctionality & heterosystemintegration & additive manufacturing (IoT, Industry 4.0, tactile internet…), packaging for mechanical, digital and power co-integration (automotive, machines, robots..),2.5D and 3D electro-optical-RF interposer and board (high performance), heterointegration for flexible, bio, organic  and large area electronics (open form factor)


Bill Bottoms, Ph.D.  (1/2017 – 1/2021)

Third Millennium Test Solutions

Santa Clara, CA  USA

Topics:   Heterogeneous Integration, Semiconductor test technology, Emerging research materials, Packaging of electronic components and systems, the global network and its future requirements, the internet of things and Smart manufacturing


Chris Bower, Ph.D. (1/2017 – 1/2021)
X-Celeprint Inc.
North Carolina, USA 
Topics: novel assembly methods, elastomer stamp micro-transfer-printing, heterogeneous integration, three-dimensional integration, manufacturing of micro-assembled displays and other large-format electronics.

Moises Cases (1/2015-1/2019)
The Cases Group, LLC
Austin, Texas, U.S.A.
Topics:  Signal and power distribution integrity for complex high-speed multiple board system designs; Modeling, simulation and verification of integrated circuits, electronic packages and system interconnect technologies; High-speed and low powers systems interconnect design methodology and tools; Digital system electrical designs, timings and integration; High-speed I/O architectures and designs; Service science management and engineering applied to engineering services
William T. Chen, Ph.D. (1/2015-1/2019)
Santa Clara, CA  USA
Topics: Semiconductor and Electronics Industry Trends and Roadmap
Xuejun Fan, Ph.D. (1/2015-1/2019)
Department of Mechanical Engineering
Lamar University
Beaumont TX USA
Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems
Paul D. Franzon, Ph.D. (1/2015-1/2019)
NC State University
Raleigh, NC  USA
Topics: 3DIC and 3D Packaging Application,Design and CAD; I/O Macromodeling, including IBIS; High-Speed, Low Power Chip to Chip Communications
Philip Garrou, Ph.D. (1/2015-1/2019)
Microelectronic Consultants of North Carolina
Research Triangle Park, NC USA
Topics: Thin film technology; IC packaging and interconnect; Microelectronic materials; 3D-IC integration


Subu Iyer, Ph.D. (6/2017 - 6/2021)
University of California, Los Angeles

Los Angeles, CA USA
Topics: Heterogeneous Integration; Flexible hybrid electronics; 3D interposer, and wafer scale integration and stacking
 R. Wayne Johnson, Ph.D. (1/2015-1/2019)
Electrical and Computer Engineering Department
Tennessee Tech University
Cookeville, TN USA
Topics: Extreme Environment Electronics

Beth Keser, Ph.D. (6/2015-6/2019)
San Diego, CA USA
Topics: Fan-Out Wafer Level Packaging and Wafer Level Packaging structures; processes, materials, tools, design rules and roadmaps; photoimageable liquid polymer films

John H. Lau, Ph.D. (1/2015-1/2019)
ASM Pacific Technology
Hong Kong
Topics: Electronics and Photonics 2D and 3D packaging and manufacturing 

Ning-Cheng Lee, Ph.D. (1/2015-1/2019)
Indium Corporation of America
Clinton, NY USA
Topics: Lead-free soldering including solderalloys, surface finishes, components, substrates, and other materials; Processes,reliability, failure modes, and troubleshooting;Advanced applications including packaging, and ultra-fine pitch applications 

S. W. Ricky Lee, Ph.D. 1/2015-1/2019)
Center for Advanced Microsystems Packaging
Hong Kong University of Science and Technology
Clear Water Bay, Kowloon, Hong Kong
Topics: Solder Joint Reliability, 3D IC Integration, and LED Packaging
Johan Liu, Ph.D. (1/2015-1/2019)
SMIT Center and Bionano Systems Laboratory
Chalmers University of Technology
Gothenburg, Sweden
Topics: Micro and nano-electronic electrically conductive adhesives

Ravi Mahajan, Ph.D. (6/2016-6/2020)
Intel Corporation
Arizona, USA
Topics: Advanced Packaging Architectures, Assembly Processes and Thermal Management


James E. Morris, Ph.D. (1/2015-1/2019)
Department of Electrical and Computer Engineering
Portland State University
Portland, Oregon USA
Topics: Electrically conductive adhesives; Electronics packaging; Nanotechnologies

Kyung W. Paik, Ph.D. (1/2015-1/2019)
Korea Advanced Institute of Science & Technology
KAIST Dept. of MS&E
Daejon, Korea
Topics: Electrically conductive adhesives (ACF, NCF,ACP, NC)
Mervi Paulasto-Kröckel, Ph.D. (6/2016-6/2020)
Aalto University
Helsinki, Finland
Topics: MEMS, electronics reliability, automotive components and packaging, implantable electronics, dissimilar materials & interfaces
Michael Pecht, Ph.D.  (1/2015-1/2019)
University of Maryland
CALCE Electronic Products and Systems Center
College Park, MD  USA
Topics: Prognostics and reliability of electronic products and systems 
Eric D. Perfecto (1/2015-1/2019)
Independent Consultant
Poughkeepsie, NY USA
TopicsFine pitch interconnect, chip to chip and chip to laminate connection, UBM and solder selection, chip package interaction and 2.5D fabrication
Karl J. Puttlitz, Ph.D. (1/2015-1/2019)
Puttlitz Engineering Consultancy, LLC
Wappingers Falls, NY USA
Topics: Flip Chip Issues/Technology; Area Array(1st & 2nd Level) Issues/Technology; Lead-free Issues/Technology
Dongkai Shangguan, Ph.D. (1/2015-1/2019) 
National Center for Advanced Packaging Co., LTD. (NCAP China)
Wuxi, China
Topics: Materials, reliability, lead-free, microelectronics packaging, board assembly, electronics manufacturing
Nihal Sinnadurai, Ph.D. (1/2015-1/2019)
Suffolk IP11 9RZ UK 
Topics: Accelerated Ageing for Reliability Assurance -theory and practical methods - including HAST (my invention originally); The use of encapsulation and plastic packaging and reliability evaluation method; PCB & Hybrid technologies; Thermal management and design
Ephraim Suhir, Ph.D. (1/2015-1/2019)
Los Altos, CA 94024 USA
Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations 


Chuan Seng Tan, Ph.D. (6/2019-6/2023)

Nanyang Technologica University

Singapore 639798

Topics: 3D Integration and packaging, Fine Pitch Cu-Cu Bonding Through Silicon Vias (TSVs), Group IV Semiconductors: Material Growth, Engineered Substrates, and Device Applications


Rao Tummala, Ph.D. (1/2015-1/2019)

Microsystems Packaging Research Center (PRC)
Georgia Institute of Technology
Atlanta, GA USA
Topics: Electronics Packaging
Walter Trybula, Ph.D. (1/2015-1/2019)
Trybula Foundation, Inc.
Austin, TX  USA
Nanomaterials Application Center Texas State University
San Marcos, TX USA
Topics: Emerging Technology, Advanced Lithography, Nanotechnology, Nano manufacturing, Nanomaterials, Environmental issues of Nanotechnology, Business Requirements of Nanotechnology
E. Jan Vardaman (1/2015-1/2019)
TechSearch International, Inc.
Austin, TX USA
Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; drivers in advanced packaging; Flip chip and wafer level packaging
Paul Wesling (1/2015-1/2019)
Saratoga, CA USA
Topics: Using Xplore, and Google Scholar to Mine IEEE's On-line Repository of Technical Information; Origins of Silicon Valley and the EPS
C.P. Wong, Ph.D. (1/2015-1/2019)
Georgia Institute of Technology
Atlanta, GA, USA
Topics: Materials

Jie Xue, Ph.D. (1/2015-1/2019)

Cisco Systems, Inc
San Jose, CA, USA
Topics:  Advanced Packaging for Networking Application; Impact of Internet of Everything (IoE) to Semiconductor Industry eco-system; High performance substrate technologies; Trends and challenges of Silicon Photonics for datacenter and networking applications
Kishio Yokouchi, Ph.D. (1/2015-1/2019
Fujitsu Interconnect Technologies Ltd.
Nagano City, Nagano, Japan
Topics: Thermal management technologies; Embedded passive component technologies; Chip to chip optical interconnection technologies