Distinguished Lecturer Program

EPS Vice President, Education: Jeff Suhling

EPS Distinguished Lecturers are selected from among  EPS Fellows, Award winners, and Society leaders, who are members of the technical community and experts in their field.  They are available to present lectures and/or courses at EPS events – Chapters, Conferences, Workshops or Symposia; as well as IEEE Student Chapter events.  EPS Chapter events are given priority.

The EPS may provide travel assistance directly to the Lecturer when requested and approved. Availability is determined by the Lecturer, based on his/her schedule.  All events must receive approval from the EPS VP, Education prior to final commitment.

The EPS Distinguished Lecturer Program (DLP) aims at serving communities interested in the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and micro-electronic systems for all electronic applications.

Lecturers will tailor their presentations to the intended audience. The DLP strives to support EPS Chapters worldwide by helping them to invite leading researchers in their respective fields and IEEE Student Chapters to encourage students to pursue EPS related fields and to join the EPS society. The DLP talk is a major event in the life of the inviting Chapter.

Requests for lectures given by one of the EPS Distinguished Lecturers (DL) must be submitted by the Chapter Chairs or the Conference/Workshop/Symposium Chair via the online DL Program Request form according to the procedure described below.

DL Program Guidelines, Policies, Procedures

DL Presentation Template

DL Program Request Form

Create Concur/IEEE Account for Expenses

Concur Travel Expense Reporting

Concur Tutorial

Concur FAQs and Information

DL Post Event Survey


EPS Distinguished Lecturers

Mudasir Ahmad (6/2017-6/2021)

Cisco Systems, Inc. 

San Jose, CA USA

Topics:  Internet of Things (IoT), Advanced Packaging, 2.5D, Heterogeneous Silicon Photonics, Advanced Reliability (Thermomechanical, Mechanical Shock), Numerical Modeling, Advanced Thermal Solutions, Stochastic Analysis, Bayesian Inference, Machine Learning, Artificial Intelligence

 

Muhannad Bakir, Ph.D. (1/2020-1/2023)

School of Electrical and Computer Engineering

Georgia Institute of Technology

Atlanta, GA USA

Topics: Emerging interconnection architectures and technologies; heterogeneous system design and integration

 

Avram Bar-Cohen, Ph.D.  (1/2020-1/2023)
Department of Mechanical Engineering
University of Maryland
College Park, Maryland  USA
Topics: Thermal packaging

 

Karlheinz Bock, Ph.D. (6/2016-6/2020)

Technische Universität Dresden

Dresden, Germany

Topics:  Multifunctionality & heterosystemintegration & additive manufacturing (IoT, Industry 4.0, tactile internet), packaging for mechanical, digital and power co-integration (automotive, machines, robots..),2.5D and 3D electro-optical-RF interposer and board (high performance), heterointegration for flexible, bio, organic  and large area electronics (open form factor)

 

Bill Bottoms, Ph.D.  (1/2017 – 1/2021)

Third Millennium Test Solutions

Santa Clara, CA  USA

Topics: Heterogeneous Integration, Semiconductor test technology, Emerging research materials, Packaging of electronic components and systems, the global network and its future requirements, the internet of things and Smart manufacturing

 

Chris Bower, Ph.D. (1/2017 – 1/2021)
X-Celeprint Inc.
North Carolina, USA 
Topics: novel assembly methods, elastomer stamp micro-transfer-printing, heterogeneous integration, three-dimensional integration, manufacturing of micro-assembled displays and other large-format electronics.

  

William T. Chen, Ph.D. (1/2020-1/2023)
ASE (U.S.) INC

Santa Clara, CA  USA

Topics: Semiconductor and Electronics Industry Trends and Roadmap

 

Xuejun Fan, Ph.D. (1/2020-1/2023)

Department of Mechanical Engineering

Lamar University

Beaumont TX USA

Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems

 

  

Philip Garrou, Ph.D. (1/2020-1/2023)

Microelectronic Consultants of North Carolina

Research Triangle Park, NC USA

Topics: Thin film technology; IC packaging and interconnect; Microelectronic materials; 3D-IC integration

 

Subu Iyer, Ph.D. (6/2017 - 6/2021)
University of California, Los Angeles

Los Angeles, CA USA

Topics:Heterogeneous Integration; Flexible hybrid electronics; 3D interposer, and wafer scale integration and stacking\

 

Beth Keser, Ph.D. (1/2020-1/2023)
Intel
San Diego, CA USA
Topics: Fan-Out Wafer Level Packaging and Wafer Level Packaging structures; processes, materials, tools, design rules and roadmaps; photoimageable liquid polymer films
 

Pradeep Lall, Ph.D. (1/2020 - 1/2023)

Auburn University

Auburn, AL, USA

Topics: Semiconductor Packaging, Modeling and Simulation, Reliability in Harsh Environments, Shock/Drop/Vibration, Cu Wirebonding, Flexible Hybrid Electronics, Additive Manufacturing, Prognostics and Health Management, LEDs, Micro CT Measurements

 

John H. Lau, Ph.D. (1/2020-1/2023)
ASM Pacific Technology
Hong Kong

Topics: Electronics and Photonics 2D and 3D packaging and manufacturing 

 

Ravi Mahajan, Ph.D. (6/2016-6/2020)

Intel Corporation

Arizona, USA

Topics: Advanced Packaging Architectures, Assembly Processes and Thermal Management

 

James E. Morris, Ph.D. (1/2020-1/2023)

Department of Electrical and Computer Engineering

Portland State University

Portland, Oregon USA

Topics: Electrically conductive adhesives; Electronics packaging; Nanotechnologies


Mervi Paulasto-Kröckel, Ph.D. (6/2016-6/2020)

Aalto University

Helsinki, Finland

Topics: MEMS, electronics reliability, automotive components and packaging, implantable electronics, dissimilar materials & interfaces

 

Eric D. Perfecto, (1/2020-1/2023)
Independent Consultant
Poughkeepsie, NY USA

Topics:Fine pitch interconnect, chip to chip and chip to laminate connection, UBM and solder selection, chip package interaction and 2.5D fabrication

 

Mark Poliks, Ph.D. (1/2020 – 1/2023)

Binghamton University (SUNY)

Binghamton, NY USA

Topics: Materials and Processes, Advanced Manufacturing, Flexible Hybrid Electronics, High Speed and Additive

 

Jose Schutt-Aine, Ph.D. (1/2020 - 1/2023)

University of Illinois

Champaign, IL, USA

Topics:High-Frequency Measurements, Mixed-Signal Design, High-Performance Computing, electromagnetic Modeling, Signal Integrity, CAD Tools for Interconnects and Packages, Machine Learning for High-Speed System Modeling 

 

Nihal Sinnadurai

Suffolk IP11 9RZ UK 

Topics: Accelerated Ageing for Reliability Assurance -theory and practical methods - including HAST (my invention originally); The use of encapsulation and plastic packaging and reliability evaluation method; PCB & Hybrid technologies; Thermal management and design

 

Ephraim Suhir, Ph.D. (1/2020-1/2023)
Los Altos, CA 94024 USA
Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations 

 

Chuan Seng Tan, Ph.D. (6/2019-6/2023)

Nanyang Technologica University

Singapore

Topics: 3D Integration and packaging, Fine Pitch Cu-Cu Bonding Through Silicon Vias (TSVs), Group IV Semiconductors: Material Growth, Engineered Substrates, and Device Applications

 

Rao Tummala, Ph.D. (1/2020 -1/2023)

Microsystems Packaging Research Center (PRC)

Georgia Institute of Technology

Atlanta, GA USA

Topics: Electronics Packaging

 

  
E. Jan Vardaman (1/2020-1/2023)

TechSearch International, Inc.

Austin, TX USA

Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; drivers in advanced packaging; Flip chip and wafer level packaging

 

Paul Wesling (1/2020-1/2023)

Saratoga, CA USA

Topics: Using Xplore, and Google Scholar to Mine IEEE's On-line Repository of Technical Information; Origins of Silicon Valley and the EPS

 

C.P. Wong, Ph.D. (1/2020-1/2023)

Georgia Institute of Technology

Atlanta, GA, USA

Topics: Materials

 

Jie Xue, Ph.D. (1/2020-1/2023)

Cisco Systems, Inc

San Jose, CA, USA

Topics:  Advanced Packaging for Networking Application; Impact of Internet of Everything (IoE) to Semiconductor Industry eco-system; High performance substrate technologies; Trends and challenges of Silicon Photonics for datacenter and networking applications