Distinguished Lecturer Program

EPS Vice President, Education: Jeff Suhling

EPS Distinguished Lecturers are selected from among  EPS Fellows, Award winners, and Society leaders, who are members of the technical community and experts in their field.  They are available to present lectures and/or courses at EPS events – Chapters, Conferences, Workshops or Symposia; as well as IEEE Student Chapter events.  EPS Chapter events are given priority.

The EPS may provide travel assistance directly to the Lecturer when requested and approved. Availability is determined by the Lecturer, based on his/her schedule.  All events must receive approval from the EPS VP, Education prior to final commitment.

The EPS Distinguished Lecturer Program (DLP) aims at serving communities interested in the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and micro-electronic systems for all electronic applications.

Lecturers will tailor their presentations to the intended audience. The DLP strives to support EPS Chapters worldwide by helping them to invite leading researchers in their respective fields and IEEE Student Chapters to encourage students to pursue EPS related fields and to join the EPS society. The DLP talk is a major event in the life of the inviting Chapter.

Requests for lectures given by one of the EPS Distinguished Lecturers (DL) must be submitted by the Chapter Chairs or the Conference/Workshop/Symposium Chair via the online DL Program Request form according to the procedure described below.

DL Program Guidelines, Policies, Procedures

DL Presentation Template

DL Program Request Form

Create Concur/IEEE Account for Expenses

Concur Travel Expense Reporting

Concur Tutorial

Concur FAQs and Information

DL Post Event Survey


EPS Distinguished Lecturers

Ramachandra Achar, Ph.D. (7/1/2020 - 6/30/2024)

Department of Electronics, Carleton University

Ottawa, Ontario, CANADA

Topics: CAD tools and methodologies for interconnects, packages, and systems with an emphasis on signal, power and EMI integrity

 

Mudasir Ahmad (6/2017-6/2021) 

Cisco Systems, Inc.  

San Jose, CA USA 

Topics:  Internet of Things (IoT), Advanced Packaging, 2.5D, Heterogeneous Silicon Photonics, Advanced Reliability (Thermomechanical, Mechanical Shock), Numerical Modeling, Advanced Thermal Solutions, Stochastic Analysis, Bayesian Inference, Machine Learning, Artificial Intelligence 

 

Kemal Aygün, Ph.D. (7/1/2020 - 6/30/2024)
Intel Corporation

Chandler,  AZ  USA
Topics: Package/socket/board/interconnect technologies, electrical simulation methodology and lab metrologies

 

Muhannad Bakir, Ph.D. (1/2020-1/2023) 

School of Electrical and Computer Engineering 

Georgia Institute of Technology 

Atlanta, GA USA 

Topics: Emerging interconnection architectures and technologies; heterogeneous system design and integration 

 

Avram Bar-Cohen, Ph.D.  (1/2020-1/2023)
Department of Mechanical Engineering
University of Maryland
College Park, Maryland  USA
Topics: Thermal packaging 

 

W. Dale Becker, Ph.D.  (7/1/2020 - 6/30/2024)

IBM
Poughkeepsie, NY  USA

Topics: Electronic Package design and integration, system design, electrical modeling tools  

 

Wendem Beyene, Ph.D. (7/1/2020 - 6/30/2024)

Intel Corporation

San Jose, CA

Topics: Electrical modeling and simulation techniques for analysis of interconnects, packages, and systems.  Machine learning techniques

 

Karlheinz Bock, Ph.D. (6/2016-6/2020) 

Technische Universität Dresden 

Dresden, Germany 

Topics:  Multifunctionality & heterosystemintegration & additive manufacturing (IoT, Industry 4.0, tactile internet), packaging for mechanical, digital and power co-integration (automotive, machines, robots..),2.5D and 3D electro-optical-RF interposer and board (high performance), heterointegration for flexible, bio, organic  and large area electronics (open form factor) 

  

Bill Bottoms, Ph.D.  (1/2017 – 1/2021) 

Third Millennium Test Solutions 

Santa Clara, CA  USA 

Topics: Heterogeneous Integration, Semiconductor test technology, Emerging research materials, Packaging of electronic components and systems, the global network and its future requirements, the internet of things and Smart manufacturing 

  

Chris Bower, Ph.D. (1/2017 – 1/2021)
X-Celeprint Inc.
North Carolina, USA 
Topics: novel assembly methods, elastomer stamp micro-transfer-printing, heterogeneous integration, three-dimensional integration, manufacturing of micro-assembled displays and other large-format electronics.  

   

William T. Chen, Ph.D. (1/2020-1/2023)
ASE (U.S.) INC 

Santa Clara, CA  USA 

Topics: Semiconductor and Electronics Industry Trends and Roadmap 

  

Xuejun Fan, Ph.D. (1/2020-1/2023) 

Department of Mechanical Engineering 

Lamar University 

Beaumont TX USA 

Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems 

   

Philip Garrou, Ph.D. (1/2020-1/2023) 

Microelectronic Consultants of North Carolina 

Research Triangle Park, NC USA 

Topics: Thin film technology; IC packaging and interconnect; Microelectronic materials; 3D-IC integration 

  

Madhu Iyengar, Ph.D. (7/1/2020 - 6/30/2024)
Google

Mountain View, CA

Topics: Thermal component and system design for packages, servers, and data centers. 

 

Subu Iyer, Ph.D. (6/2017 - 6/2021)
University of California, Los Angeles 

Los Angeles, CA USA 

Topics:Heterogeneous Integration; Flexible hybrid electronics; 3D interposer, and wafer scale integration and stacking\ 

  

Beth Keser, Ph.D. (1/2020-1/2023)
Intel
San Diego, CA USA
Topics: Fan-Out Wafer Level Packaging and Wafer Level Packaging structures; processes, materials, tools, design rules and roadmaps; photoimageable liquid polymer films
  

Pradeep Lall, Ph.D. (1/2020 - 1/2023) 

Auburn University 

Auburn, AL, USA 

Topics: Semiconductor Packaging, Modeling and Simulation, Reliability in Harsh Environments, Shock/Drop/Vibration, Cu Wirebonding, Flexible Hybrid Electronics, Additive Manufacturing, Prognostics and Health Management, LEDs, Micro CT Measurements 

  

John H. Lau, Ph.D. (1/2020-1/2023)
ASM Pacific Technology
Hong Kong 

Topics: Electronics and Photonics 2D and 3D packaging and manufacturing  

 

Ravi Mahajan, Ph.D. (6/2016-6/2020) 

Intel Corporation 

Arizona, USA 

Topics: Advanced Packaging Architectures, Assembly Processes and Thermal Management 

  

James E. Morris, Ph.D. (1/2020-1/2023) 

Department of Electrical and Computer Engineering 

Portland State University 

Portland, Oregon USA 

Topics: Electrically conductive adhesives; Electronics packaging; Nanotechnologies
 

Mervi Paulasto-Kröckel, Ph.D. (6/2016-6/2020) 

Aalto University 

Helsinki, Finland 

Topics: MEMS, electronics reliability, automotive components and packaging, implantable electronics, dissimilar materials & interfaces  

 

Eric D. Perfecto, (1/2020-1/2023)
Independent Consultant
Poughkeepsie, NY USA

Topics:Fine pitch interconnect, chip to chip and chip to laminate connection, UBM and solder selection, chip package interaction and 2.5D fabrication  

 

Mark Poliks, Ph.D. (1/2020 – 1/2023) 

Binghamton University (SUNY) 

Binghamton, NY USA 

Topics: Materials and Processes, Advanced Manufacturing, Flexible Hybrid Electronics, High Speed and Additive

 

Jose Schutt-Aine, Ph.D. (1/2020 - 1/2023) 

University of Illinois 

Champaign, IL, USA 

Topics:High-Frequency Measurements, Mixed-Signal Design, High-Performance Computing, electromagnetic Modeling, Signal Integrity, CAD Tools for Interconnects and Packages, Machine Learning for High-Speed System Modeling  

  

Nihal Sinnadurai

Suffolk IP11 9RZ UK  

Topics: Accelerated Ageing for Reliability Assurance -theory and practical methods - including HAST (my invention originally); The use of encapsulation and plastic packaging and reliability evaluation method; PCB & Hybrid technologies; Thermal management and design 

  

Ephraim Suhir, Ph.D. (1/2020-1/2023)
Los Altos, CA 94024 USA
Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations  

 

Chuan Seng Tan, Ph.D. (6/2019-6/2023) 

Nanyang Technologica University 

Singapore 

Topics: 3D Integration and packaging, Fine Pitch Cu-Cu Bonding Through Silicon Vias (TSVs), Group IV Semiconductors: Material Growth, Engineered Substrates, and Device Applications 

  

Rao Tummala, Ph.D. (1/2020 -1/2023) 

Microsystems Packaging Research Center (PRC) 

Georgia Institute of Technology 

Atlanta, GA USA 

Topics: Electronics Packaging 

 

E. Jan Vardaman (1/2020-1/2023) 

TechSearch International, Inc. 

Austin, TX USA 

Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; drivers in advanced packaging; Flip chip and wafer level packaging 

  

Paul Wesling (1/2020-1/2023) 

Saratoga, CA USA 

Topics: Using Xplore, and Google Scholar to Mine IEEE's On-line Repository of Technical Information; Origins of Silicon Valley and the EPS 

 

C.P. Wong, Ph.D. (1/2020-1/2023) 

Georgia Institute of Technology 

Atlanta, GA, USA 

Topics: Materials 

  

Jie Xue, Ph.D. (1/2020-1/2023) 

Cisco Systems, Inc 

San Jose, CA, USA 

Topics:  Advanced Packaging for Networking Application; Impact of Internet of Everything (IoE) to Semiconductor Industry eco-system; High performance substrate technologies; Trends and challenges of Silicon Photonics for datacenter and networking applications