Distinguished Lecturer Program

EPS Vice President, Education: Eric Perfecto

EPS Distinguished Lecturers are selected from amongEPS Fellows, Award winners, and Society leaders, who are members of the technical community and experts in their field.They are available to present lectures and/or courses at EPS events – Chapters, Conferences, Workshops or Symposia; as well as IEEE Student Chapter events.EPS Chapter events are given priority.

The EPS may provide travel assistance directly to the Lecturer when requested and approved. Availability is determined by the Lecturer, based on his/her schedule.All events must receive approval from the EPS VP, Education prior to final commitment.

The EPS Distinguished Lecturer Program (DLP) aims at serving communities interested in the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and micro-electronic systems for all electronic applications.

Lecturers will tailor their presentations to the intended audience. The DLP strives to support EPS Chapters worldwide by helping them to invite leading researchers in their respective fields and IEEE Student Chapters to encourage students to pursue EPS related fields and to join the EPS society.

Requests for lectures given by one of the EPS Distinguished Lecturers (DL) must be submitted by the Chapter Chairs or the Conference/Workshop/Symposium Chair via the online DL Program Request form according to the procedure described below.

DL lectures (live or virtual) which are recorded should be place in the EPS Resource Center by obtaining a signed Webinar Consent form.

Attendees of DL talks can receive Professional Development Hours (PDH) by completing the survey.

DL Program Guidelines, Policies, Procedures

DL Presentation Templates

DL Program Request Form

Create Concur/IEEE Account for Expenses

Concur Travel Expense Reporting

Concur Tutorial

Concur FAQs and Information

DL Post Event Survey

If you are interested in nominating an EPS Distinguished Lecturer, please contact the EPS Vice President, Education:Eric Perfecto

EPS Distinguished Lecturers


Ramachandra Achar, Ph.D. (7/1/2020 - 6/30/2024)

Department of Electronics, Carleton University

Ottawa, Ontario, CANADA

Topics: CAD tools and methodologies for interconnects, packages, and systems with an emphasis on signal, power and EMI integrity


Mudasir Ahmad (1/2022 -12/2025)



Topics:Internet of Things (IoT), Advanced Packaging, 2.5D, Heterogeneous Silicon Photonics, Advanced Reliability (Thermomechanical, Mechanical Shock), Numerical Modeling, Advanced Thermal Solutions, Stochastic Analysis, Bayesian Inference, Machine Learning, Artificial Intelligence


Kemal Aygün, Ph.D. (7/1/2020 - 6/30/2024)

Intel Corporation


Topics: Package/socket/board/interconnect technologies, electrical simulation methodology and lab metrologies


Muhannad Bakir, Ph.D. (1/2024 - 12/2027)

School of Electrical and Computer Engineering

Georgia Institute of Technology

Atlanta, GA USA

Topics: Emerging interconnection architectures and technologies; heterogeneous system design and integration


W. Dale Becker, Ph.D. (7/1/2020 - 6/30/2024)


Hyde Park, NYUSA

Topics: Electronic Package design and integration, system design, electrical modeling tools


Wendem Beyene, Ph.D. (7/1/2020 - 6/30/2024)


San Jose, CA

Topics: Electrical modeling and simulation techniques for analysis of interconnects, packages, and systems.Machine learning techniques


Karlheinz Bock, Ph.D.  (7/2020-7/2024)

Technische Universität Dresden

Dresden, Germany

Topics:Multifunctionality & heterosystemintegration & additive manufacturing (IoT, Industry 4.0, tactile internet), packaging for mechanical, digital and power co-integration (automotive, machines, robots..),2.5D and 3D electro-optical-RF interposer and board (high performance), heterointegration for flexible, bio, organicand large area electronics (open form factor)


Bill Bottoms, Ph.D. (6/2021 – 6/2025)

Third Millennium Test Solutions

Santa Clara, CAUSA

Topics: Heterogeneous Integration, Semiconductor test technology, Emerging research materials, Packaging of electronic components and systems, the global network and its future requirements, the internet of things and Smart manufacturing


Chris Bower, Ph.D. (6/2021 – 6/2025)

X-Celeprint Inc.

North Carolina, USA

Topics: Novel assembly methods, elastomer stamp micro-transfer-printing, heterogeneous integration, three-dimensional integration, manufacturing of micro-assembled displays and other large-format electronics.


Tanja Braun, Ph.D. (7/2023 – 6/2027)

Fraunhofer IZM

Berlin, Germany

Topics:Advanced Packaging, Heterogeneous Integration, Flip Chip, Chiplet, Fan-out Wafer and Panel Level Packaging.


William T. Chen, Ph.D. (1/2024 -12/2027)


Santa Clara, CAUSA

Topics: Semiconductor and Electronics Industry Trends and Roadmap


Kuan Yew Cheong, Ph.D. (1/2024 -12/2027)

School of Materials and Mineral Resources Engineering

Universiti Sains Malaysia

Topics: Materials, Physical Failure Analysis


Xuejun Fan, Ph.D. (1/2024 - 12/2027)

Department of Mechanical Engineering

Lamar University

Beaumont, TX USA

Topics: Design, modeling and reliability in micro-/nano- electronic packaging and microsystems


Madhu Iyengar, Ph.D. (7/1/2020 - 6/30/2024)


Mountain View, CA, USA

Topics: Thermal component and system design for packages, servers, and data centers.


Subu Iyer, Ph.D. (6/2021 - 5/2025)

University of California, Los Angeles

Los Angeles, CA USA

Topics:Heterogeneous Integration; Flexible hybrid electronics; 3D interposer, and wafer scale integration and stacking.


Beth Keser, Ph.D. (1/2024-12/2027)


San Diego, CA USA

Topics:Fan-Out Wafer Level Packaging and Wafer Level Packaging structures; processes, materials, tools, design rules and roadmaps; Advanced Packaging; Introduction to Packaging; and photoimageable liquid polymer filmsFan-Out Wafer Level Packaging and Wafer Level Packaging structures; processes, materials, tools, design rules and roadmaps; photoimageable liquid polymer films.


Pradeep Lall, Ph.D. (1/2024 - 12/2027)

Auburn University

Auburn, AL USA

Topics: Semiconductor Packaging, Modeling and Simulation, Reliability in Harsh Environments, Shock/Drop/Vibration, Cu Wirebonding, Flexible Hybrid Electronics, Additive Manufacturing, Prognostics and Health Management, LEDs, Micro CT Measurements


John H. Lau, Ph.D. (1/2024 - 12/2027)

Unimicron Technology Corporation

Palo Alto, CA USA

Topics: Electronics and Photonics 2D and 3D packaging and manufacturing


Ravi Mahajan, Ph.D. (7/2020 - 6/2024)

Intel Corporation

Arizona, USA

Topics: Advanced Packaging Architectures, Assembly Processes and Thermal Management


James E. Morris, Ph.D. (1/2024 -12/2027)

Department of Electrical and Computer Engineering

Portland State University

Portland, Oregon USA

Topics: Electrically conductive adhesives; Electronics packaging; Nanotechnologies


Rajen Muguran, Ph.D. (7/2022 - 6/2026)

Texas Instruments

Dallas, TX, USA

Topics:Multiphysics and System Co-Design modeling for complex analog and mixed-signal packaging, mmWave/THz signal integrity, power electronics packaging, and System-Level EMI/EMC modeling, analysis, and characterization.


Katherine "Kitty" Pearsall, Ph.D. (7/2024-6/2027)

President of Boss Precision Inc.

Independent Consultant

Austin, TX USA

Topics:Supply chain, component qualification and end quality; Leadership


Eric D. Perfecto (1/2024-12/2027)

IBM Research

Poughkeepsie, NY USA

Topics:Fine pitch interconnect, chip to chip and chip to laminate connection, UBM and solder selection, chip package interaction and 2.5D fabrication


Mark Poliks, Ph.D. (1/2024 – 12/2027)

Binghamton University (SUNY)

Binghamton, NY USA

Topics: Materials and Processes, Advanced Manufacturing, Flexible Hybrid Electronics, High Speed and Additive


 Gamal Refai-Ahmed, Ph.D. (7/1/2022 - 6/30/2026)


San Jose, CA USA

Topics: Thermo-mechanical Semiconductor and Electronics Industry Roadmap and directions, Advanced holistic Thermo-mechanicalsolution, assembly and reliability ofHeterogeneous Packagingand Silicon Photonics, Future thermo-mechanical technology, architecture for component and system


Katsuyuki Sakuma, Ph.D. (7/1/2024 - 6/30/2027)

IBM T.J. Watson Research Center; Visiting Professor at Tohoku University, Japan

New York, NY USA

Topics:3D integration technologies, bonding technologies, advanced packaging, and biomedical sensors


Jose Schutt-Aine, Ph.D. (7/1/2024 - 2/2027)

University of Illinois

Champaign, IL USA

Topics:High-Frequency Measurements, Mixed-Signal Design, High-Performance Computing, electromagnetic Modeling, Signal Integrity, CAD Tools for Interconnects and Packages, Machine Learning for High-Speed System Modeling


John Shalf, 1/2024 - 12/2027)

Lawrence Berkeley National Laboratory

Berkeley, CA USA

Topics: HPC System Integration, System Integration, Photonics and Packaging


Dongkai Shangguan, Ph.D. (7/1/2023 - 6/30/2027)

Thermal Engineering Associates, Inc.

San Jose, CA USA

Topics: Heterogeneous Integration and SiP; Electronics Packaging and Miniaturization; Materials; Thermal management; Reliability; Electronics manufacturing technology; Flexible hybrid electronics


Rohit Sharma, Ph.D. (1/2023 - 12/2026)

Indian Institute of Technology Ropar

Punjab, India

Topics:Design of High-speed Graphene-based and 2D materials-based nanoelectronics; Electrical-Thermal co-design of electronic packages and microsystems; Application of Machine Learning in design and analysis of interconnects; Heterogeneous integration.


Ephraim Suhir, Ph.D. (1/2024 -12/2027)

Los Altos, CA 94024 USA

Topics: Accelerated life testing; Probabilistic physical design for reliability; Bonded assemblies; Thermal stress; Predictive modeling; Fiber optics structures: design for reliability; Dynamic response to shocks and vibrations


Andrew Tay, Ph.D. (1/2023-1/2027)

SHINE Center, National University of Singapore


Topics: Thermomechanical reliability of microelectronics packages; Thermal and failure analysis of microelectronic devices; Thermal management of electronic and EV battery systems; Solder joint reliability; Delamination and fracture; Moisture effects; Modelling and simulation.


Manos Tentzeris, Ph.D. (7/1/2023 - 6/30/2027)

Georgia Institute of Technology

Atlanta, GA USA

Topics: RF/mmW/3D/electronics industry/nanotechnology/materials/packaging/3D printing/energy harvesting-zero power


Rao Tummala, Ph.D. (1/2024 -12/2027)

Microsystems Packaging Research Center (PRC)

Georgia Institute of Technology

Atlanta, GA USA

Topics: Electronics Packaging


E. Jan Vardaman (1/2024-12/2027)

TechSearch International, Inc.

Austin, TX USA

Topics: International developments in semiconductor packaging, manufacturing and assembly; SiP: Business and technology Trends; drivers in advanced packaging; Flip chip and wafer level packaging


Paul Wesling (1/2024 -12/2027)

Saratoga, CA USA

Topics:Origins of Silicon Valley and the Electronics Packaging Society; the IEEE/SEMI/ASME Heterogeneous Integration Roadmap and how to use it (as editor for the 2019 Roadmap).