EPS Achievement Certificate

The EPS Achievement Certificate is aimed at early-career professionals working in the field of electronics packaging.  It is especially intended to encourage the career development of young professionals including advanced graduate students.  

Criteria: Current EPS Member

To receive your certificate, 15 professional development hours (PDHs) must be completed. This can be obtained from a combination of the following:

1). IEEE EPS Webinar (1 PDH) – must complete the post event quiz on the Resource Center

2). IEEE EPS Distinguished Lecture (1 PDH) - must complete the online survey

3). Professional Development Courses – must complete survey and CEU credit form. Previous ECTC PDCs from the last 10 years can be used towards this if the CEU application was completed at the time of the course. PDCs from ESTC and EPTC 2018 and forward can be used.

- Electronic Components and Technology Conference (USA)  = 4 PDHs

- Electronic Systems-Integration Technology Conference (Europe) = 3 PDHs

- Electronic Packaging Technology Conference (Asia) = 4 PDHs

4). Author of IEEE T-CPMT and/or EPS conference paper(s) (5 PDHs) – paper must be published in IEEE Xplore within the last 5 years.

5). Reviewer for IEEE T-CPMT (3 Reviews = 5 PDH) within the last 5 years.

Once you have completed any combination of the above and received 15 PDHs, please complete the certificate form to request your Electronics Packaging Society Certificate of Achievement.

 

 

Congratulations to these EPS Members on receiving the IEEE Certificate of Achievement from the IEEE Electronics Packaging Society and completing the required number of professional development hours.

Jinto George, University of Sherbrooke

Arkaprovo Das,  Simyog Technology Pvt. Ltd.

Chuan Seng Tan, Nanyang Technological University

Koushik Ramachandran, GLOBALFOUNDRIES

Jonas Zuercher, ESPROS Photonics AG

David Dahl, Hamburg University of Technology

Prof. Shashikant Patil, SVKMs NMIMS Shirpur Campus

Beth Keser, Intel

Eric Perfecto, Independent Consultant

Katsuyuki Sakuma, IBM Thomas J. Watson Research Center

Tan Yik Yee, ON Semiconductor Sdn. Bhd.

Christopher Breach, KCI UK Holdings Ltd

Stevan Hunter, ON Semiconductor, BYU-Idaho, ASU, UMD CALCE

Venkateswararao Para, Microsystems

Gan Chong Leong, Micron Technology

Venkatesh Avula, Georgia Institute of Technology

Jeff Suhling, Auburn University

Shaw Fong Wong, Intel

Siddharth Ravichandran, Georgia Institute of Technology

Omkar Gupte, Georgia Institute of Technology

Agneta Elisabet Ljungbro, Ericsson AB

Joseph Soucy, Charles Stark Draper Laboratory

Chandrasekharan Nair, Intel Corporation

Chintan Buch, Applied Materials Inc.

Atom Watanabe, Georgia Institute of Technology

Vidya Jayaram, Intel Corporation

Chris Bailey, University of Greenwich

Anil B. Lingambudi, IBM

Shuye Zhang,  Harbin Institute of Technology

Ralph Remsburg, University of Hertfordshire

Ken Lawrence, CAES

Stoyan Stoyanov, University of Greenwich

Sreejith Kochupurackal Rajan, Georgia Institute of Technology

Nikhilendu Tiwary, Aalto University

Faxing Che, Micron Semiconductor Asia Operations Pte. Ltd

Ankit Kaul, Georgia Institute of Technology

Dr. Kaustubh Basu, TASK Microelectronics

Vance Liu, Micron Memory Technology

Henry Antony Martin, Chip Integration Technology Center (CITC) and Delft University of Technology (TUD)

Patrick Thompson, Texas Instruments

Sasi Kumar Tippabhotla, Institute of Microelectronics, A*Star Research Entities

Luka Huang, Micron Memory Taiwan Co., Ltd.