EPS Achievement Certificate
The EPS Achievement Certificate is aimed at early-career professionals working in the field of electronics packaging. It is especially intended to encourage the career development of young professionals including advanced graduate students.
Criteria: Current EPS Member
To receive your certificate, 15 professional development hours (PDHs) must be completed. This can be obtained from a combination of the following:
1). IEEE EPS Webinar (1 PDH) – must complete PDH evaluation
2). Professional Development Courses – must complete survey and CEU credit form. Previous ECTC PDCs from the last 10 years can be used towards this if the CEU application was completed at the time of the course. PDCs from ESTC and EPTC 2018 and forward can be used.
- Electronic Components and Technology Conference (USA) = 4 PDHs
- Electronic Systems-Integration Technology Conference (Europe) = 3 PDHs
- Electronic Packaging Technology Conference (Asia) = 4 PDHs
3). Author of IEEE T-CPMT and/or EPS conference paper(s) (5 PDHs) – paper must be published in IEEE Xplore within the last 5 years.
4). Reviewer for IEEE T-CPMT (3 Reviews = 5 PDH) within the last 5 years.
Once you have completed any combination of the above and received 15 PDHs, please complete the certificate form to request your Electronics Packaging Society Certificate of Achievement.
Congratulations to these EPS Members on receiving the IEEE Certificate of Achievement from the IEEE Electronics Packaging Society and completing the required number of professional development hours.
Jinto George, University of Sherbrooke
Arkaprovo Das, Simyog Technology Pvt. Ltd.
Chuan Seng Tan, Nanyang Technological University
Koushik Ramachandran, GLOBALFOUNDRIES
Jonas Zuercher, ESPROS Photonics AG
David Dahl, Hamburg University of Technology
Prof. Shashikant Patil, SVKMs NMIMS Shirpur Campus
Beth Keser, Intel
Eric Perfecto, Independent Consultant
Katsuyuki Sakuma, IBM Thomas J. Watson Research Center
Tan Yik Yee, ON Semiconductor Sdn. Bhd.
Christopher Breach, KCI UK Holdings Ltd
Stevan Hunter, ON Semiconductor, BYU-Idaho, ASU, UMD CALCE
Venkateswararao Para, Microsystems
Gan Chong Leong, Micron Technology
Venkatesh Avula, Georgia Institute of Technology
Jeff Suhling, Auburn University
Shaw Fong Wong, Intel
Siddharth Ravichandran, Georgia Institute of Technology
Omkar Gupte, Georgia Institute of Technology
Agneta Elisabet Ljungbro, Ericsson AB
Joseph Soucy, Charles Stark Draper Laboratory
Chandrasekharan Nair, Intel Corporation
Chintan Buch, Applied Materials Inc.
Atom Watanabe, Georgia Institute of Technology
Vidya Jayaram, Intel Corporation
Chris Bailey, University of Greenwich
Anil B. Lingambudi, IBM
Shuye Zhang, Harbin Institute of Technology
Ralph Remsburg, University of Hertfordshire
Ken Lawrence, CAES
Stoyan Stoyanov, University of Greenwich
Sreejith Kochupurackal Rajan, Georgia Institute of Technology
Nikhilendu Tiwary, Aalto University
Faxing Che, Micron Semiconductor Asia Operations Pte. Ltd
Ankit Kaul, Georgia Institute of Technology
Dr. Kaustubh Basu, TASK Microelectronics
Vance Liu, Micron Memory Technology
Henry Antony Martin, Chip Integration Technology Center (CITC) and Delft University of Technology (TUD)