| 2020-11-20 - 2020-11-20 |
Powering Heterogeneous Integration: An overview of the Integrated Power Electronics Chapter of the HIR Roadmap |
Webinar - Online |
Prof. Patrick McCluskey |
| 2020-10-21 |
Overview of the Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap |
Webinar - Online |
Jeff Demmin |
| 2020-09-10 - 2020-09-10 |
Packaging of Electronics for Medical, Health and Wearables Applications |
Webinar - Online |
Prof Mark Poliks |
| 2020-08-25 - 2020-08-25 |
Accelerated Testing and Design for Reliability in Electronic and Photonic Packaging Engineering |
Webinar - Online |
Dr. Ephraim Suhir |
| 2020-08-06 - 2020-08-06 |
Overview of the Integrated Photonics Chapter of the Heterogeneous Integration Roadmap |
Webinar - Online |
Dr. Bill Bottoms and Prof. Amr Helmy |
| 2020-08-05 |
Heterogeneous Integration - Why Is It Becoming Such a Big Deal and How Does It Affect Electron Device Development |
Webinar - Online |
Prof. Subramanian S. Iyer |
| 2020-07-23 - 2020-07-23 |
Overview of the Co-Design Chapter of the Heterogeneous Integration Roadmap |
Webinar - Online |
Professor José Schutt-Ainé and Professor Rohit Sharma |
| 2020-07-08 - 2020-07-08 |
Overview of the Modeling & Simulation Chapter of the Heterogeneous Integration Roadmap |
Webinar - Online |
Professor Chris Bailey and Professor Xuejun Fan |
| 2020-07-02 - 2020-07-02 |
Test Technology for Heterogeneous Integration |
Webinar - Online |
Dave Armstrong, Don Blair, Ken Lanier and Marc Hutner |
| 2020-06-18 - 2020-06-18 |
Overview of the High-Performance Computing Chapter of the Heterogeneous Integration Roadmap |
Webinar - Online |
Dr. Dale Becker and Prof. Kanad Ghose |
| 2020-05-27 - 2020-05-27 |
Thermal Management Challenges and Opportunities for Heterogeneous Packages |
Webinar - Online |
Dr. Madhu Iyengar and Dr. Mehdi Asheghi |
| 2020-05-13 - 2020-05-13 |
Interconnects for 2D and 3D Architectures |
Webinar - Online |
Ravi Mahajan |
| 2020-05-06 - 2020-05-06 |
Heterogeneous Integration Roadmap Driving Force and Enabling Technology for Systems of the Future |
Webinar - Online |
Bill Chen and Bill Bottoms |
| 2020-02-06 - 2020-02-06 |
Implantable Electronics: Emerging Packaging Needs, Challenges and Recent Industry Breakthroughs |
Webinar - Online |
Prof. Ranu Jung, Gaurav Mehrotra and Ossi Lahtinen |
| 2019-09-25 - 2019-09-25 |
New Results on Electromigration Modeling - A departure from Blech's Theory |
Webinar - Online |
Dr. Xuejun Fan |
| 2019-04-16 - 2019-04-16 |
Making and Qualifying Reliable Extreme Environment Electronics |
Webinar - Online |
Dr. Patrick McCluskey |
| 2019-02-26 - 2019-02-26 |
Can Moore's Law for Packaging Replace Moore's Law for ICS? |
Webinar - Online |
Prof. Rao Tummala |
| 2018-11-29 |
TSV and FOWLP Reliability Challenge Overview |
Webinar - Online |
Darvin Edwards |
| 2018-11-20 |
Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration |
Webinar - Online |
Dr. Ning-Cheng Lee |
| 2018-08-10 |
Flip Chip Interconnection and Its Application |
Webinar - Online |
Dr. Shengmin Wen |
| 2018-05-04 |
IoT Energy Harvesting |
Webinar - Online |
Dushan Vuckovic, Marc Dunham and Denis Pasero |
| 2018-03-27 |
A Moore's Law for Packaging |
Webinar - Online |
Subramanian S. Iyer |
| 2018-01-31 |
Multi-Die Heterogeneous Integration: Design Considerations and Technology Demonstrations |
Webinar - Online |
Muhannad Bakir |
| 2017-12-04 |
The Origins of Silicon Valley: Early EPS Pioneers |
Webinar - Online |
Paul Wesling |
| 2017-10-18 |
Automotive Sensor Packaging Trends |
Webinar - Online |
Jan Vardaman |
| 2017-09-19 |
3D Printing: Hype, Hope, or Happening |
Webinar - Online |
Chris Bailey, Jie Xue |
| 2017-08-10 |
Micro Assembly Using Elastomer Stamps |
Webinar - Online |
Chris Bower |
| 2017-07-19 |
Probabilistic Design for Reliability (PDfR) in Electronics and Photonics |
Webinar - Online |
Ephraim Suhir |
| 2016-10-27 |
IEEE CPMT Webinar: Manufacturing Micron-sized Systems |
Webinar - Online |
Walt Trybula |
| 2016-09-28 |
Understanding Voids in Flip Chip Interconnects |
Webinar - Online |
Eric Perfecto |
| 2016-08-10 |
IEEE CPMT Webinar: Interconnect Materials in Electronic Packaging |
Webinar - Online |
Kwang-Lung Lin |
| 2016-07-27 |
IEEE CPMT Webinar: Sintered Nanoparticle-Based Interconnections |
Webinar - Online |
Alfred Zinn |
| 2016-02-04 - 2016-02-04 |
CPMT Webinar: Photonics in Heterogeneous 3D-SiP: A Key to Maintaining the Pace of Progress |
Webinar - Online |
Bill Bottoms |
| 2015-10-15 - 2015-10-15 |
IEEE CPMT Webinar: Interconnect and Heterogeneous System Integration Technologies for Computing and RF Systems |
Webinar - Online |
Muhannad Bakir |
| 2014-09-24 |
IEEE CPMT Webinar: Co-Design for Unlocking the 3D IC Potential: A Micro-fluidic Cooling Perspective |
Webinar - Online |
Ankur Srivastava |
| 2014-07-24 |
IEEE CPMT Webinar: Power Electronics Packaging, Reliability, and Thermal Management |
Webinar - Online |
Patrick McCluskey |
| 2014-06-25 - 2014-06-25 |
IEEE CPMT Webinar: Packaging Challenges in a World Driven by the Internet of Things and Migration to the Cloud |
Webinar - Online |
Bill Bottoms |
| 2014-02-05 - 2014-02-06 |
IEEE CPMT Webinar: 3D Printing: From Prototype to Production |
Webinar - Online |
Melba Kurman, Mike O'Reilly |
| 2013-11-17 - 2013-11-18 |
IEEE CPMT Webinar: Nanomaterials for Printed Electronics |
Webinar - Online |
Katsuaki Suganuma |
| 2013-11-13 |
IEEE CPMT Webinar: Thermo-Mechanical and Mechanical Reliability of Electronics (USA begins p.m.) |
Webinar - Online |
Craig Hillman |
| 2013-11-13 |
IEEE CPMT Webinar: Thermo-Mechanical and Mechanical Reliability of Electronics (USA begins a.m.) |
Webinar - Online |
Craig Hillman |
| 2013-10-17 |
IEEE CPMT Webinar: Platform Independent Photonic Design Tools and Concepts |
Webinar - Online |
Arjen Bakker, Ronald Broeke |
| 2013-09-11 |
IEEE CPMT Webinar: Sub-Terahertz Photonics for Ultra-Wideband Wireless Communications (rescheduled from 17 June 2013) |
Webinar - Online |
Guillermo Carpintero |
| 2013-07-11 |
IEEE CPMT Webinar: HELIOS -- Silicon photonics: from elementary building blocks to complex circuits |
Webinar - Online |
Laurent Fulbert, Jean-Marc Fedeli |
| 2013-04-11 |
IEEE CPMT Webinar: Active plasmonics co-integrated with Si-photonics and electronics for on-chip interconnects |
Webinar - Online |
Nikos Pieros, Michael Waldow |
| 2013-03-14 |
IEEE CPMT Webinar: Advanced Packaging for High Power LEDs |
Webinar - Online |
Rafael Jordan |
| 2013-02-13 |
IEEE CPMT Webinar: Electro-optical Printed Circuit Board and Interconnect Technologies and their Application to Data Centre and HPC Systems |
Webinar - Online |
Marika Immonen, Richard Pitwon |
