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IEEE CPMT Webinar: Advanced Packaging for High Power LEDs

Lecture
Advanced Packaging for High Power LEDs
Date
2013-03-14
Location
Webinar - Online
Contact
Marsha Tickman – m.tickman@ieee.org
Presenter
Rafael Jordan
Description

Earn 1 Professional Development Hour (PDH) for completing the webinar - Complete Form​

Ultra High Brightness LEDs have gained importance in recent years and will be one of the key products for the optoelectronic industry in the near future. The market for mid and high power LED assemblies will increase by three to five times in the next 8 years and in this field especially the general lighting will be increase 8 times. In 2010 the first 10 % of this economic growth were done manly by retrofit. But retrofit is extremely limited by the old assembly and interconnection specifications, which don’t allow sufficient heat dissipation for an efficient use of LEDs. Future LED luminaries will be based on advanced integration technologies and new packages.

Solutions for heat dissipation through the first level interconnect is a key issue for a successful LED packaging in this context. Therefore this presentation describes more in detail the impact of established bonding technologies such as gluing and soldering and the application capabilities of new technologies like sintering, transient liquid phase soldering and nano sponge thermocompression bonding. To compare the different approaches a new method to measure the real temperature at the junction will be discussed. Application examples show the usability of the development results.

Event Recording