EPS Webinar Archive - IEEE Electronics Packaging Society

EPS Webinar Archive

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IEEE CPMT Webinar: Packaging Challenges in a World Driven by the Internet of Things and Migration to the Cloud

Date
2014-06-25 - 2014-06-25
Location
Webinar - Online
Contact
Marsha – m.tickman@ieee.org
Presenter
Bill Bottoms
Description

Earn 1 Professional Development Hour (PDH) for completing the webinar - Complete Form

The semiconductor industry growth was driven first by government requirements with mainframe computing as the primary platform, the second phase of growth came from desktop computers for both business and consumer applications. Today mobile consumer de

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