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IEEE CPMT Webinar: Power Electronics Packaging, Reliability, and Thermal Management

Date
2014-07-24
Time
New York (U.S.A. - New York) Thursday, July 24, 2014 at 11:00:00 AM / San Francisco (U.S.A. - California) Thursday, July 24, 2014 at 8:00:00 AM / Berlin (Germany - Berlin) Thursday, July 24, 2014 at 5:00:00 PM / Tokyo (Japan) Friday, July 25, 2014 at
Location
Webinar - Online
Contact
Marsha Tickman – m.tickman@ieee.org
Presenter
Patrick McCluskey
Description

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Abstract:  Power electronics are becoming ubiquitous in engineered systems as they replace traditional ways to control the generation, distribution, and use of energy. They are used in products as diverse as home appliances, cell phone towers, aircraft, wind turbines, radar systems, and smart grids. This widespread incorporation has resulted in significant improvements in efficiency over previous technologies, but it also has made it essential that the reliability of power electronics be characterized and enhanced. Recently, increased power levels, made possible by new compound semiconductor materials, combined with increased packaging density have led to higher heat densities in power electronic systems, especially inside the switching module, making thermal management more critical to performance and reliability of power electronics.

Following a review of heat transfer principles and thermal management techniques, along with physics-of-failure approaches to assess and ensure reliability, this short course will present the latest developments in the packaging, assembly, and thermal management of power electronic modules and systems, along with modeling and testing techniques. This course will emphasize thermal packaging techniques capable of addressing performance limits and reliability concerns associated with increased power levels and power density in power electronic components.

Patrick McCluskey (B.S.(’84) Lafayette College; M.S.(’86) and Ph.D. (’91), Materials Science and Engineering, Lehigh University) is a Professor of Mechanical Engineering at the University of Maryland, College Park and the Mechanical Engineering Department’s Division Leader for Electronic Products and Systems.  He has over 25 years of research experience in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and power applications.  Dr. McCluskey has published three books and over 125 peer-reviewed technical articles with over 2000 citations, including over 40 articles in IEEE journals and major EPS conferences, such as ECTC and iTHERM.  He has also served as technical program or general chair of IEEE conferences on high temperature electronics and integrated power electronic packaging, as well as being the organizer of the President’s panel session on Power Module Integration at ECTC 2016, and panel sessions at ITHERM and ITEC.  Dr. McCluskey has provided a short course on integrated thermal packaging of power electronics at ECTC and iTHERM since 2013, along with short courses at IWIPP and 3D-PEIM.  He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, and of Microelectronics Reliability.  He is a senior member of IEEE and the chair of the EPS Technical Committee on Energy and Power Electronics. He has also served as IEEE EPS representative to the Future Car Workshop.  He is a fellow of IMAPS and a member of ASME and TMS/AIME.

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