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IEEE CPMT Webinar: Co-Design for Unlocking the 3D IC Potential: A Micro-fluidic Cooling Perspective
- Date
- 2014-09-24
- Time
- 11:00:00 AM EDT
- Location
- Webinar - Online
- Contact
- Marsha Tickman – m.tickman@ieee.org
- Presenter
- Ankur Srivastava
- Description
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This webinar focuses on the thermo-electrical co-design of three-dimensional chip stacks, which are poised to become the next packaging paradigm in the electronic industry. While this paradigm provides significant improvements in device density, interc
- Event Recording
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