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IEEE CPMT Webinar: Co-Design for Unlocking the 3D IC Potential: A Micro-fluidic Cooling Perspective

Date
2014-09-24
Time
11:00:00 AM EDT
Location
Webinar - Online
Contact
Marsha Tickman – m.tickman@ieee.org
Presenter
Ankur Srivastava
Description

This webinar focuses on the thermo-electrical co-design of three-dimensional chip stacks, which are poised to become the next packaging paradigm in the electronic industry. While this paradigm provides significant improvements in device density, interc

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