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Understanding Voids in Flip Chip Interconnects

Date
2016-09-28
Location
Webinar - Online
Contact
Marsha Tickman – m.tickman@ieee.org
Presenter
Eric Perfecto
Description
Earn 1 Professional Development Hour (PDH) for completing the webinar - Complete Form

Presenter: Eric Perfecto

 

Pb-free solder is now ubiquitous throughout the packaging industry. Pb-freesolder interconnects dominate the high-end packaging interconnects: from large ball grid array (BGA) used on organic laminate to board connections, to flip chip joints on laminates, to micro-pillar forchipto Si on 2.5D or 3D interconnects   But, how robust are these connections? Which defects are common and which can be avoided?  This talk will cover one of the more common interconnect defects: solder voids.  It will explain the root cause of solder voids occurring during structure fabrication, assembly and reliability stress, as well as detection methods and possible actions to prevent them. 

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