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Micro Assembly Using Elastomer Stamps

Webinar - Online
Denise Manning – d.manning@ieee.org
Chris Bower

Presenter: Dr. Chris Bower

Earn 1 Professional Development Hour (PDH) for completing the webinar - Complete Form


Integrating ultra-miniaturized compound semiconductor devices onto non-native substrates enables new kinds of products with desirable functionalities and cost structures that are inaccessible by conventional means.  Micro assembly technologies are the practical ways to make such micro-scale combinations possible.  Micro assembly using elastomer stamps, called micro-transfer printing technology (µTP), is a widely-demonstrated form of micro assembly, having demonstrated applicability in optical communications, magnetic storage, photovoltaics, bio-integrated electronics, and displays. The common value proposition of µTP in all of these applications is to provide a product that uses the most advantageous semiconductor devices and has the most desirable form factor.  Those characteristics provide cost benefits, performance metrics, or combinations of properties that are inaccessible or impractical without µTP. 

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