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Micro Assembly Using Elastomer Stamps

Date
2017-08-10
Location
Webinar - Online
Contact
Denise Manning – d.manning@ieee.org
Presenter
Chris Bower
Description

Presenter: Dr. Chris Bower

ABSTRACT:

Integrating ultra-miniaturized compound semiconductor devices onto non-native substrates enables new kinds of products with desirable functionalities and cost structures that are inaccessible by conventional means.  Micro assembly technologies are the practical ways to make such micro-scale combinations possible.  Micro assembly using elastomer stamps, called micro-transfer printing technology (µTP), is a widely-demonstrated form of micro assembly, having demonstrated applicability in optical communications, magnetic storage, photovoltaics, bio-integrated electronics, and displays. The common value proposition of µTP in all of these applications is to provide a product that uses the most advantageous semiconductor devices and has the most desirable form factor.  Those characteristics provide cost benefits, performance metrics, or combinations of properties that are inaccessible or impractical without µTP. 

Event Recording