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Making and Qualifying Reliable Extreme Environment Electronics

2019-04-16 - 2019-04-16
11:00 AM EDT
Webinar - Online
Denise Manning – d.manning@ieee.org
Dr. Patrick McCluskey

Abstract: Today’s most challenging applications of electronics technology require operation in the harshest of environments. Electronics have left the desktop and air conditioned computer room to enter environments ranging from the deepest ocean depths to the vastness of space.  These environments combine extreme temperatures with extreme pressures, high levels of shock and vibration, and exposure to damaging chemicals.  Applications as diverse as avionics/planetary exploration (Venus: 460°C surface, 90 atm pressure, H2SO4), oil and gas exploration (T > 150°C, high pressure, corrodants, drilling shock), and underhood automotive propulsion (T > 165°C, vibration, road salt) require new materials and mechanical design solutions that address thermal management, stress management, fatigue resistance, corrosion resistance, durability, reliability, maintainability, and sustainability.  In addition, temperatures are rising for many power electronic systems as well, with the combination of higher power density modules and the availability of high temperature stable semiconductor devices. This presentation will discuss the latest work in the areas of wide bandgap semiconductor reliability, high temperature interconnection including copper wire bonding, lead-free attach material synthesis, 3D integrated thermal packaging, and advanced manufacturing of power electronics – all focused on designing, manufacturing and qualifying electronics for reliable use in the most extreme environments


Presenter: Dr. McCluskey is a Professor at the University of Maryland, College Park where he is the Director of the Design and Systems Reliability Division of the Mechanical Engineering department.  Affiliated with CALCE, he has published extensively on the packaging and reliability of electronics and microsystems for high power and extreme environments, including editing/co-editing three books and authoring over 150 technical articles and book chapters with over 2500 citations. He has served as technical and general chair for conferences in these research areas. He is a fellow of IMAPS, a senior member of IEEE, and a member of the Board of Governors of the IEEE Electronic Packaging Society.

Event Recording