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Implantable Electronics: Emerging Packaging Needs, Challenges and Recent Industry Breakthroughs

Date
2020-02-06 - 2020-02-06
Time
11:00 AM EDT
Location
Webinar - Online
Contact
Denise Manning – d.manning@ieee.org
Sponsorship
Sponsor
Presenter
Prof. Ranu Jung, Gaurav Mehrotra and Ossi Lahtinen
Description

Part I: Packaging Needs and Challenges in Neuroprosthetic technologies

(Ranu Jung, Biomedical Engineering, Florida International University)

Neuroprosthetic technologies aim to continuously interface with the nervous system to restore lost motor or sensory functions from injury and diseases. Such technologies have already been helping patients with hearing and vision loss, amputees, patients with spincal cord injury, and other brain-related disorders. Emerging neuroprosthetic technologies and the needs for advanced packaging solutions for miniaturized functional integration in implantable electronics will be described in the first part. Recent advances in the development of a fully implantable, wirelessly controlled system to directly stimulate nerves and restore sensation with neural-enabled prosthetic hand, develop by the speaker and her team, will be highlighted.

Part II: Glass packaging for long-term implantable electronics (Ossi Lahtinen, SCHOTT Primoceler Oy, Finland) 

For the past 40 years medical implants have been mostly encapsulated inside titanium. However, using glass as a package material can offer several benefits. The RF transparency of glass enables recharging, data transfer and reprogramming of implants. Transparency to visible light is an advantage in wide range of optical applications: Hermeticity is one of the key factors when reliability is a concern. Glass micro bonding combined together with hermetic through glass vias (TGVs) helps designing a chronically implantable electronics device. The hermeticity of the designed package can be tested according to Military standards, such as MIL-STD-883 and MIL-STD-750.

Part III: Packaging of Fully-Implantable Photonic Glucose Sensors (Gaurav Mehrotra, Renesas)

Eversense CGM is the world’s first, long-term, fully-implantable (subcutaneous) CGM developed by Senseonics Inc. in collaboration with Integrated Device Technology (a Renesas Company). In this talk, Gaurav will highlight the system integration and packaging challenges associated with Eversense CGM. Type 1 diabetes requires lifelong insulin therapy with doses adjusted based on monitoring of blood glucose levels. ‘Self-monitoring’ (finger pricking) only provides a few data points per day and does not capture several periods of highs and lows. Continuous Glucose Monitoring (CGM) systems take continuous periodic measurements thereby dramatically increasing the amount of information available to the patient and their healthcare providers. Access to this real-time data can help patients achieve tight glycemic management and do it safely.

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