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Heterogeneous Integration Roadmap Driving Force and Enabling Technology for Systems of the Future

Date
2020-05-06 - 2020-05-06
Location
Webinar - Online
Contact
Denise Manning – d.manning@ieee.org
Sponsorship
Sponsor
Presenter
Bill Chen and Bill Bottoms
Description

The Heterogeneous Integration Roadmap (HIR) provides a long term vision for the electronics industry, identifying difficult future challenges and potential solutions.  The roadmap offers professionals, industry, academia, and research institutes a comprehensive view of the landscape and strategic technology requirementas for the electronics industry evolution for the next 15 years, and a 25 years vision for the heterogeneous integration of emerging devices and everging materials with longer research and development timelines. The purpose is to stimulate pre-competitive collaboration and thereby accelerate the pace of progress.

The HIR is designed to be a system application – driven roadmap, blending the duality of market pull and technology push across the entire electronics ecosystem. The 23 chapters, including the Executive Summary includes market application drivers, building blocks of electronics systems, cross cutting technology areas, and integration technologies, represent the the interacting complexities of the electronics industry. This webinar will give an introduction of the Heterogeneous Integration Roadmap. We shall  highlight a few of the examples from the chapters and give perspectives of how the roadmap may be used by the profession.

Download HIR Chapter 1 HIR Overview and Executive Summary

Event Recording
View Heterogeneous Integration Roadmap Driving Force and Enabling Technology for Systems of the Future recording