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IEEE CPMT Webinar: Electro-optical Printed Circuit Board and Interconnect Technologies and their Application to Data Centre and HPC Systems

Date
2013-02-13
Location
Webinar - Online
Contact
Marsha Tickman – m.tickman@ieee.org
Presenter
Marika Immonen, Richard Pitwon
Description

Earn 1 Professional Development Hour (PDH) for completing the webinar - Complete Form​

Interconnect speeds in multiple protocols within data center and HPC systems will increase to over 25 Gb/s over the coming years thereby severely impacting cost and performance in future data center. Electro-optical printed circuit board technology (EOCB) based on integrated planar optical waveguides has been the subject of research and development for many years to provide a cost viable, fully integrated system embedded optical interconnect solution to this impending bottleneck, however a number of constraints of this technology have yet to be overcome. This talk will provide an introduction to the relative merits and challenges of electro-optical printed circuit board and interconnect technologies. The advantages of embedded optical interconnect to future data center and HPC applications is discussed as well as the challenges that must be overcome to enable commercial proliferation. In addition, the talk will include a summary of Xyratex’s and TTM’s past and current research and developments project activities in this field over the past decade including polymer and glass planar optical waveguides, connectors and high precision optical assembly techniques.

Event Recording