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Heterogeneous Integration Roadmap (HIR) Webinar Series (OPEN TO EVERYONE AT NO COST)
The electronics industry has reinvented itself through multiple disruptive changes in technologies, products, applications and markets. Our industry continues to evolve with the rapid migration of logic, memory, and applications to the cloud, the evolution of the Internet of Things (IoT) to the Internet of Everything (IoE), the proliferation of smart mobile devices everywhere, the rise of 5G, the increasing presence of microelectronics in wearables, health applications, and the rapidly evolving issues related to autonomous vehicles applications. Underlying all the changes are the rapid advancement of AI and the increasing abundance of data & data analytics. The pace of innovation is increasing to meet these challenges.
The Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines. With the release of the 2019 HIR edition, the preparation of the 2020 edition is underway.
We are announcing the Heterogeneous Integration Webinar Series. The series is based upon the content of the 2019 HIR edition. The webinars will be delivered by the authors of the individual roadmap chapters. The primary purposes are to broaden the proliferation of the roadmap content to the profession and industry and to seek feedback from the roadmap users for inclusion into the 2020 edition2
Watch for the invitation or visit this website for schedule details and instructions about how to register.
Upcoming HIR Webinar
Title: Overview of the Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap
Date: October 21, 2020
Time: 11:00 AM EDT
Presenter: Jeff Demmin
The Aerospace & Defense Chapter of the Heterogeneous Integration Roadmap addresses the specific challenges of A&D electronics, including long product lifecycles, low volumes, demanding environments, security, and extreme performance requirements. This webinar will review the landscape to A&D heterogeneous integration from the inaugural 2019 edition, as well as the high-level roadmap table being rolled out in the 2020 update.
Jeff Demmin is the Semiconductor and Defense Project Manager at Keysight Technologies in Santa Rosa, CA. Previously he was a Senior Lead Scientist at Booz Allen Hamilton, where he worked on heterogeneous integration programs for DARPA and other government clients. Before that, he was with STATS ChipPAC, and he worked for over a decade at Tessera in corporate development and IP acquisition. His career started in semiconductor package design at National Semiconductor, and he has also served as the Editor-in-Chief of Advanced Packaging magazine. He has a Bachelor’s degree in Physics from Princeton and a Master’s degree in Materials Science from Stanford. He has been in the industry long enough that all of his patents have expired.
Upcoming Panel Session Sponsored by the PELS SFBAC and EPS - Open to All
Title: Integrated Power - A Virtual Panel Session
Date: October 22, 2020
Time: 4:30 - 6:30 PM PDT
Power Systems on Chip (PSoC) have evolved significantly over the past decade or two and have made inroads into mass production. Between integrated magnetics and switched-capacitor ICs, there are many options for integrated power available today. Solutions have been used in mass-market cell phones, telecommunications hardware and more.
Our speakers will discuss specific technologies they’ve developed to help miniaturize power supplies and push higher power density. We will then have a discussion comparing and contrasting the technologies, and field questions about how they can be used in applications.