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Heterogeneous Integration Roadmap (HIR) Webinar Series (OPEN TO EVERYONE AT NO COST)
The electronics industry has reinvented itself through multiple disruptive changes in technologies, products, applications and markets. Our industry continues to evolve with the rapid migration of logic, memory, and applications to the cloud, the evolution of the Internet of Things (IoT) to the Internet of Everything (IoE), the proliferation of smart mobile devices everywhere, the rise of 5G, the increasing presence of microelectronics in wearables, health applications, and the rapidly evolving issues related to autonomous vehicles applications. Underlying all the changes are the rapid advancement of AI and the increasing abundance of data & data analytics. The pace of innovation is increasing to meet these challenges.
The Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines. With the release of the 2019 HIR edition, the preparation of the 2020 edition is underway.
We are announcing the Heterogeneous Integration Webinar Series. The series is based upon the content of the 2019 HIR edition. The webinars will be delivered by the authors of the individual roadmap chapters. The primary purposes are to broaden the proliferation of the roadmap content to the profession and industry and to seek feedback from the roadmap users for inclusion into the 2020 edition2
Watch for the invitation or visit this website for schedule details and instructions about how to register.
Title: Overview of the Integrated Photonics Chapter of the Heterogeneous Integration Roadmap
Webinars in the HIR Series are open to everyone
Date: August 6, 2020
Time: 11:00 AM EDT - Register Here
Presenters: Bill Bottoms and Amr Helmy
The Heterogeneous Integration Roadmap (HIR) includes twenty-two technical working groups that span a wide range of topics within the heterogeneous integration effort. This talk will focus on the progress and scope of the Photonics technical working group. Also in this talk we shall overview someof the highlights of the technical working group presentations in the annual symposium. Those address photonic issues pertinent to high performance computing, optical interconnects for electronic chips as well as data centre applications. For example power consumption and thermal management challenges were highlighted as key challenges to be addressed in the near future and will be included in this talk.
The first volume photonics application was for telephony beginning with under-sea cables. By the 1980s it dominated that segment. Since then photons have been entering new applications and getting closer to the integrated circuits. Today we collaborate with almost all other HIR technical working groups as well as other organizations worldwide where innovation for new applications and improved performance for photonics takes place. Part 2 discusses collaborations in place today and imagines how this might progress in the future to accelerate the pace of progress.discusses collaborations in place today and imagines how this might progress in the future to accelerate the pace of progress.
Dr. Bill Bottoms received his Ph.D. from Tulane University and joined the faculty at Princeton Unviersity after graduation. He has worked in venture capital and was involved in founding several Companies including Tessera and Microwlectronics Packaging. He has served as Chairman and CEO of several companies both public and private. He currently serves as:
- Emeritus member of the Board of Tulane University
- Chairman of the SEMI Awards Committee
- Chairman of Fluence Analytics
- Member of the Board of MIT's Microelectronics Center
- Chairman of 3MTS
- Co-Chair of the Heterogeneous Integration Roadmap
Amr S Helmy is a Professor of Photonics at the University of Toronto, Canada.He received his Ph.D. from the University of Glasgow. After, he joined Agilent labs in the UK working for the semiconductor product group. He now leads a group in Photonics at the University of Toronto. He represents the IEEE Photonics Society within the IEEE Quantum Initiative and is Co-Chair of the HIR also representing the Photonics Society.
Title: Design for Reliability and Accelerated Testing in Electronics and Photonics Packaging Engineering
Open to everyone
Date: August 25, 2020
Time: 11:00 AM EDT - Register Here
Presenter: Ephraim Suhir
The webinar addresses an evolving philosophy of accelerated testing in electronic and photonic packaging, and could be viewed as a possible extension and modification of HALT for applications where high level of operational reliability is critical, such as, e.g., aerospace, military, long-haul communications, or medical. Highly-focused and highly cost-effective failure-oriented- accelerated-testing (FOAT) approach is suggested as a suitable experimental basis of the probabilistic design for reliability (PDfR) concept. The PDfR concept is used to assess the product's lifetime and the corresponding never-zero probability of failure in the field for the given product and application and make this probability adequate for the given product and application. The general concepts are illustrated by numerical examples.
Dr. Suhir is on the faculty of Portland State University,USA; Technical University, Vienna, Austria and James Cook University, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. USA, Life Fellow of the IEEE, the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS) and has over 400+ publications in electronics and reliability engineering.