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Heterogeneous Integration Roadmap (HIR) Webinar Series (OPEN TO EVERYONE AT NO COST)
The electronics industry has reinvented itself through multiple disruptive changes in technologies, products, applications and markets. Our industry continues to evolve with the rapid migration of logic, memory, and applications to the cloud, the evolution of the Internet of Things (IoT) to the Internet of Everything (IoE), the proliferation of smart mobile devices everywhere, the rise of 5G, the increasing presence of microelectronics in wearables, health applications, and the rapidly evolving issues related to autonomous vehicles applications. Underlying all the changes are the rapid advancement of AI and the increasing abundance of data & data analytics. The pace of innovation is increasing to meet these challenges.
The Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines. With the release of the 2019 HIR edition, the preparation of the 2020 edition is underway.
We are announcing the Heterogeneous Integration Webinar Series. The series is based upon the content of the 2019 HIR edition. The webinars will be delivered by the authors of the individual roadmap chapters. The primary purposes are to broaden the proliferation of the roadmap content to the profession and industry and to seek feedback from the roadmap users for inclusion into the 2020 edition2
Watch for the invitation or visit this website for schedule details and instructions about how to register.